journal article·2024-12Open access

A Diamond Heater‐Thermometer Microsensor for Measuring Localized Thermal Conductivity: A Case Study in Gelatin Hydrogel

Linjie Ma, Jiahua Zhang, Zheng Hao, Jixiang Jing, Tongtong Zhang, Yuan Lin, Zhiqin Chu

Advanced Optical Materials· Volume 12· Issue 34

Abstract

Abstract Understanding the microscopic thermal effects of the hydrogel is important for its application in diverse fields, including thermal‐related studies in tissue engineering and thermal management for flexible electronic devices. In recent decades, localized thermal properties, such as thermal conductivity, have often been overlooked due to technical limitations. To tackle this, the study proposes a new hybrid diamond microsensor that is capable of simultaneous temperature control and readout in a decoupled manner. Specifically, the sensor consists of a silicon pillar (heater) at ≈10 microns in length, topped by a micron‐sized diamond particle that contains silicon‐vacancy (SiV) centers (thermometer) with 1.29 temperature measurement sensitivity. Combining this innovative, scalable sensor with a newly established simulation model that can transform heating‐laser‐induced temperature change into thermal conductivity, an all‐optical decoupled method is introduced with ≈0.05 W m−1 K−1 precision, which can reduce laser crosstalk. For the first time, the thermal conductivity change of hydrogels during the gelation process is tracked and the existence of variation is demonstrated. The study introduces a rapid, undisturbed technique for measuring microscale thermal conductivity, potentially serving as a valuable tool for cellular thermometry, and highlights the idea that decoupling can reduce crosstalk from different lasers, which is helpful for quantum sensing.
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Research context

OpenAlex topics: Diamond and Carbon-based Materials Research · Thermal properties of materials · Heat Transfer and Optimization

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Electrical and Electronic Engineering The University of Hong Kong Pok Fu Lam Hong Kong SAR China

Department of Mechanical Engineering The University of Hong Kong Pok Fu Lam Hong Kong SAR China

School of Biomedical Sciences The University of Hong Kong Pok Fu Lam Hong Kong SAR China

Funding

National Natural Science Foundation of China

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