Multi‐Stamping on Multi‐Prestrain (MSMP) Process for Multifunctional Wearable Bioelectronics with Optimized Electromechanical Properties

Abstract Advances in soft, wearable bioelectronics for physiological monitoring enable new diagnostic and therapeutic possibilities. Traditional devices rely on complex microfabrication and suffer from mechanical mismatches between soft substrates and rigid metal layers. While transfer printing onto prestrained substrates is proposed, the existing one‐step prestrain methods have limitations in optimizing the mechanical properties of each subcircuit on multifunctional sensors, which may require different characteristics across components. To address these issues, this study proposes the multi‐stamping on multi‐prestrain (MSMP) process, where sensor elements are transferred onto a substrate under varied prestrains (0–150%) within a single integrated platform. This approach not only resolves the mismatch issue, but also ensures that each sensor element exhibits optimal electromechanical properties based on its prestrain level. Sensors requiring high sensitivity are fabricated under low prestrains, whereas those needing stability during motion are produced under high prestrains. Using the MSMP process, an integrated sensor with strain, electromyogram, and temperature sensors is fabricated at prestrains of 0, 100, and 150%, respectively. Mechanical simulation precisely predicts the deformation of printed patterns before/after prestrains, thereby achieving accurate alignment across multiple printing steps. Sensor performance is validated under various physiological conditions, suggesting potential contribution of MSMP in various biomedical fields.