Shapeable Materials: Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics (Adv. Mater. Technol. 4/2019)
Source abstract
Abstract
Rapid, large scale manufacture of efficient 3D devices is just one of many possibilities stemming from the concept of self-assembled mesoscale architectures, as reviewed by Daniil Karnaushenko, Tong Kang and Oliver G. Schmidt, which promise improved scalability in construction and packaging. In article number 1800692, the various technologies facilitating the self-assembly of 3D structures are analyzed, as well as the numerous microelectronic components and novel biomedical appliances that can be created using such techniques.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Modular Robots and Swarm Intelligence
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Affiliations
Institute for Integrative Nanosciences Institute for Solid State and Materials Research Dresden (IFW Dresden) 01069 Dresden Germany
Material Systems for Nanoelectronics Chemnitz University of Technology 09107 Chemnitz Germany
Center for Advancing Electronics Dresden Dresden University of Technology 01062 Dresden Germany
References
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