journal article·2023-06

Automated and Wireless Accelerated Heat Soak Testing System to Assess Hermetic Failure Mechanism of Inductively Powered Implantable Medical Applications

Pyungwoo Yeon, Min‐gu Kim, Pingyu Wang, Choongsoon Kim, Oliver Brand, Maysam Ghovanloo

Advanced Materials Technologies· Volume 8· Issue 12
Publisher page

Abstract

Abstract Reliability and lifetime estimation of implantable medical devices (IMDs) is one of the essential steps in their design and development. As any failure of IMDs can result in serious health risks for the patients, they should be guaranteed not to fail over their intended lifetime under the harsh body fluidic and chemical environments. Traditional leak tests are applicable to large cm‐scale IMDs, and they are often destructive, laborious, and costly. This paper presents an automated and wireless accelerated heat soak testing system to assess hermetic failure mechanisms in small mm‐sized inductively powered IMDs. A high‐throughput readout coil array printed circuit board can test hermeticity of multiple mm‐sized wireless IMDs simultaneously in a harsh environment (e.g., 45 °C/90% RH with an error range of ±0.2% for 18 days gage repeatability and reproducibility test). An accelerated heat soak test is performed to evaluate the electronic durability and estimate the lifetime of the IMDs. This work focuses on validating the proposed system interrogating with eight inductor–capacitor sensors, composed of an interdigitated capacitive sensor connected to an inductor patterned polyimide substrate, to examine hermetic failure mechanisms of parylene‐C encapsulation for wireless IMDs as well as broader miniature‐sized consumer electronics.
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Research context

OpenAlex topics: Neuroscience and Neural Engineering · Advanced Sensor and Energy Harvesting Materials · Wireless Power Transfer Systems

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Electrical Engineering Stanford University Stanford CA 94305 USA

Sensing HW Division Apple Inc. Cupertino California 95014 United States

Department of Electrical and Computer Engineering Inha University 22212 Incheon Republic of Korea

Department of Information and Communication Engineering Inha University 22212 Incheon Republic of Korea

Department of Materials Science and Engineering Stanford University Stanford CA 94305 USA

Allegro Microsystems LLC Manchester NH 03031 USA

School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta GA 30332 USA

Institute for Electronics and Nanotechnology Georgia Institute of Technology Atlanta GA 30332 USA

Silicon Creations Inc. Lawrenceville GA 30043 USA

Funding

National Science Foundation

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