Preparation of Ultra‐Lightweight Buckypaper‐Ni‐Cu High‐Performance Electromagnetic Shielding Films by Chemical‐Electroplating Modified Method

Abstract This study successfully fabricates an ultra‐lightweight buckypaper(BP)‐Ni‐Cu layered structure film using vacuum filtration and chemical‐electroplating methods, achieving a thickness of 34 µm and a surface density of 50 g m⁻². The film exhibits a notably low surface square resistance of 9.5 mΩ □⁻¹. Regarding electromagnetic shielding performance, it exhibits exceptional effectiveness across multiple frequency bands: 96.67 dB in the Partial S‐band (2.6–4 GHz), 65.05 dB in the C1 band (4–6 GHz), 64.23 dB in the C2 band (6–8 GHz), 87.04 dB in the X band (8–12 GHz), and 90.46 dB in the Ku band (12–18 GHz). In terms of mechanical properties, compared with the tensile fracture strength of 33.67 MPa of the BP film, the tensile fracture strength of the BP‐Ni film is enhanced to 51.9 MPa, and that of the BP‐Ni‐Cu film is elevated to 49.43 MPa. Additionally, the film demonstrates good thermal stability at temperatures up to 300 ^°C. It also exhibits favorable electrical conductivity. Overall, considering its excellent characteristics, including multi‐band shielding and ultra‐lightweight properties, this film presents a novel and highly promising solution for aerospace electromagnetic shielding applications.