Rheological Tunable Solid–Liquid Two‐Phased Binary Metals Enable Thermoplastic and Electronic Conductive Composites for Conductive Adhesives and Conductive Wires

Abstract Thermoplastic conductive composites are significant materials in modern electronic technologies due to their universal fabrication conditions, phenomenal electrical conductivity, and remarkable mechanical properties. However, due to the heavy phase separation occurs during thermo‐processing between conductive inorganic fillers and polymer matrixes. Conventional thermoplastic conductive composites exhibit low electrical conductivity, and undesirable mechanical properties, which significantly restrict their applications. This work successfully arrives at the solution for the phase segregation by combining gallium‐stannum binary metal (Ga/Sn BM) and commercial ethylene vinyl acetate (EVA) copolymer to successfully realize thermoplastic conductive composites. The thermoplastic conductive Ga/Sn BM‐EVA composites which exhibit remarkable thermal processability, ultrahigh electrical conductivity, and considerable mechanical performance. Rheological tunable solid‐liquid two‐phased Ga/Sn BM with tunable viscosities is the key to achieve excellent miscibility between fillers and polymers. The rheological measurement results demonstrate the critical viscosity matching between Ga/Sn BM and EVA copolymer for the successful fabrication of thermoplastic conductive composites. More importantly, the Ga/Sn BM‐EVA composites are adapted with classic polymer melt‐processing, which indicates the scalable production. The thermoplastic conductive Ga/Sn BM‐EVA composites emerge as an exciting substitute for electronic conductive hot melt adhesives and conductive wires in intelligent electronic technologies.