journal article·2019-05

Dual Silicon Oxycarbide Accelerated Growth of Well‐Ordered Graphitic Networks for Electronic and Thermal Applications

Paul D. Garman, Jared M. Johnson, Vishank Talesara, Hao Yang, Xinpeng Du, Junjie Pan, Dan Zhang, Jianfeng Yu, Eusebio Cabrera, Ying‐Chieh Yen, Jose Castro, Wu Lu, Ji‐Cheng Zhao, Jinwoo Hwang, L. James Lee

Advanced Materials Technologies· Volume 4· Issue 5
Publisher page

Abstract

Abstract While effective in circumventing the transfer process of graphene films from metals to insulating substrates, graphene chemical vapor deposition (CVD) methods which grow directly on the surface of insulating substrates suffer from slow growth rates, lack of covalent bonding between both graphene layers within the film and the entire film and its substrate, and the inability to grow films beyond nanoscale thickness. An atmospheric pressure chemical vapor deposition (APCVD) process is described utilizing preplaced silicone rubber and continuously fed tetraethyl orthosilicate (TEOS) as dual silicon oxycarbide (SiOC) sources to facilitate fast surface coverage (30 s) and z‐thickness growth (136 nm min−1) of graphitic coatings consisting of a network of covalently bonded graphene layers directly on quartz while providing strong adhesion between the coating and the substrate via a semiconductive transition layer. This process can produce graphitic networks for a wide range of products including transparent conducting and semiconductive nanoscale graphene films, anisotropic micrometer‐scale coatings with in‐plane thermal conductivity >1000 W m−1 K−1 and standalone flakes with >40 µm thickness for thermal management applications.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Graphene research and applications · Thermal properties of materials · Carbon Nanotubes in Composites

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Chemical and Biomolecular Engineering The Ohio State University Columbus OH 43210 USA

Department of Materials Science and Engineering The Ohio State University Columbus OH 43210 USA

Department of Electrical and Computer Engineering The Ohio State University Columbus OH 43210 USA

Department of Integrated Systems Engineering The Ohio State University Columbus OH 43210 USA

Nanomaterial Innovation, Ltd. 1109 Millcreek Ln Columbus OH 43220 USA

Funding

Ohio Third Frontier Program

References (49)

Show source-provided references
1. 10.1038/nmat184910.1038/nmat1849 ↗
2. 10.1038/nmat306410.1038/nmat3064 ↗
3. 10.1126/science.110289610.1126/science.1102896 ↗
4. 10.1016/j.carbon.2013.12.07310.1016/j.carbon.2013.12.073 ↗
5. 10.1021/ar300203n10.1021/ar300203n ↗
6. 10.1039/C5RA09405D10.1039/C5RA09405D ↗
7. 10.1016/j.surfcoat.2013.06.05010.1016/j.surfcoat.2013.06.050 ↗
8. 10.1021/ja206363310.1021/ja2063633 ↗
9. 10.1038/ncomms749910.1038/ncomms7499 ↗
10. 10.1039/c3ce27029g10.1039/c3ce27029g ↗
11. 10.1063/1.472611410.1063/1.4726114 ↗
12. 10.1002/adma.20120297310.1002/adma.201202973 ↗
13. 10.1002/adfm.20120263810.1002/adfm.201202638 ↗
14. 10.1002/adma.20130189910.1002/adma.201301899 ↗
15. 10.1002/smll.20110182710.1002/smll.201101827 ↗
16. 10.1038/ncomms853610.1038/ncomms8536 ↗
17. 10.1016/j.carbon.2016.11.00710.1016/j.carbon.2016.11.007 ↗
18. 10.1002/adfm.20110242310.1002/adfm.201102423 ↗
19. 10.1007/s10853-015-9440-z10.1007/s10853-015-9440-z ↗
20. 10.1021/nn401995z10.1021/nn401995z ↗
21. 10.1103/PhysRevLett.97.18740110.1103/PhysRevLett.97.187401 ↗
22. 10.1103/PhysRevB.38.608410.1103/PhysRevB.38.6084 ↗
23. 10.1002/sia.191710.1002/sia.1917 ↗
24. 10.1016/S0022-3093(99)00101-510.1016/S0022-3093(99)00101-5 ↗
25. 10.3390/ma306351810.3390/ma3063518 ↗
26. 10.1103/PhysRevB.60.1090310.1103/PhysRevB.60.10903 ↗
27. 10.1016/j.matchemphys.2005.07.04810.1016/j.matchemphys.2005.07.048 ↗
28. 10.1080/1478643070139404110.1080/14786430701394041 ↗
29. 10.1016/S0968-4328(99)00132-810.1016/S0968-4328(99)00132-8 ↗
30. 10.1016/j.ssc.2007.03.05210.1016/j.ssc.2007.03.052 ↗
31. 10.1016/j.carbon.2007.02.03410.1016/j.carbon.2007.02.034 ↗
32. 10.1038/nmat87610.1038/nmat876 ↗
33. 10.1021/nn102598m10.1021/nn102598m ↗
34. 10.1088/0953-8984/20/39/39522010.1088/0953-8984/20/39/395220 ↗
35. 10.1016/j.jnucmat.2017.02.00410.1016/j.jnucmat.2017.02.004 ↗
36. 10.1063/1.475133010.1063/1.4751330 ↗
37. 10.1021/nl400321r10.1021/nl400321r ↗
38. 10.1023/A:100876582901210.1023/A:1008765829012 ↗
39. 10.1016/j.apsusc.2005.01.02010.1016/j.apsusc.2005.01.020 ↗
40. 10.1002/adma.20039008710.1002/adma.200390087 ↗
41. 10.1021/nn900927810.1021/nn9009278 ↗
42. 10.1126/science.124387910.1126/science.1243879 ↗
43. 10.1021/acsanm.8b0199810.1021/acsanm.8b01998 ↗
44. 10.1002/adma.20180363910.1002/adma.201803639 ↗
45. 10.1088/2053-1583/aa69b510.1088/2053-1583/aa69b5 ↗
46. 10.1063/1.181943110.1063/1.1819431 ↗
47. 10.1038/nmat111410.1038/nmat1114 ↗
48. 10.1063/1.481586710.1063/1.4815867 ↗
49. 10.1016/j.actamat.2007.05.03710.1016/j.actamat.2007.05.037 ↗