Molecularly Engineered Self‐Healing Polyimide with Dynamic Bond Exchange for Durable and Flexible Electronics (Adv. Mater. Technol. 21/2025)
Source abstract
Abstract
Self-Healing Polyimide This cover image describes a self-healing polyimide developed for flexible electronics. It highlights reversible dynamic disulfide bonds and siloxane-containing aliphatic chains allowing rapid surface repair via Joule heating. The balance of rigid and flexible segments in the backbone allows tunable mechanical properties. The illustration emphasizes the potential of the material for durable and flexible electronic devices. More information can be found in the Research Article by Heung Cho Ko, Nam-Ho You, and co-workers (10.1002/admt.202500834).
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Polymer composites and self-healing · Synthesis and properties of polymers · Polydiacetylene-based materials and applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Carbon Composite Materials Research Center Institute of Advanced Composite Materials Korea Institute of Science and Technology (KIST) Wanju‐gun Jeollabuk‐do 55324 South Korea
Department of Materials Science and Engineering Gwangju Institute of Science and Technology (GIST) Buk‐gu Gwangju 61005 South Korea
References
Reference metadata was not supplied for this record.