journal article·2024-05Open access

Improving Process Compatibility of Multilayer Organic Fiber Photodetectors by Combining Coaxial Thermal Evaporation with Dip‐Coating

Jiaao Wu, Yi Li, Xueyuan Wu, Xiaoran Zhang, Qingxia Liu, Shuai Qu, Liu Yuan, Yang Wang

Advanced Materials Technologies· Volume 9· Issue 9

Abstract

Abstract Fiber photodetectors (FPDs) are promising candidates for wearable applications due to their flexibility, knittability, and full‐angle detection. The current state‐of‐the‐art FPDs based on inorganic photosensitive materials show drawbacks in mechanical flexibility. The organic FPDs (OFPDs) are superior, while the fabrication is limited by multi‐layer process compatibility issues. Herein, a diode‐type five‐layer OFPD with Zn/ZnO/PBDB‐T:ITIC‐Th/MoO3/PEDOT:PSS structure is prepared by combining thermal evaporation with a successive dip‐coating method. It is worth mentioning that the uniform coaxial MoO3 interfacial layer is processed by the proposed fiber‐compatible thermal evaporation technique, while the other functional layers are enabled by the solution‐based dip‐coating method. At the bias of −0.5 V, the optimized OFPD exhibits a dark current density of 8.46 × 10−8 A cm−2, a responsivity of 86.4 mA W−1 (@ 760 nm), and a specific detectivity of over 1011 Jones in the visible range of 400–760 nm. Besides, the device displays a fast response speed of 0.44 and 0.14 ms for rise and fall time, showing the capability of full‐angle detection. The device is demonstrated in photoplethysmography for real‐time heart‐rate monitoring, suggesting its potential for practical application in wearable electronics.
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Research context

OpenAlex topics: Nanomaterials and Printing Technologies · Thin-Film Transistor Technologies · Advanced Sensor and Energy Harvesting Materials

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

State Key Laboratory of Electronic Thin Films and Integrated Devices School of Optoelectronic Science and Engineering University of Electronic Science and Technology of China Chengdu 610054 China

Glasgow College University of Electronic Science and Technology of China Chengdu 610054 China

AECC Beijing Institute of Aeronautical Materials Beijing 100089 China

Funding

National Key Research and Development Program of China · National Science Fund for Distinguished Young Scholars · National Natural Science Foundation of China

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