journal article·2026-02Open access

Multiparameter Closed‐Loop Control to Advance Reliability of Aerosol Jet Printing

Andrew J. Schwartz, Jeremy D. Rurup, Ethan B. Secor

Advanced Materials Technologies· Volume 11· Issue 3

Abstract

Abstract Aerosol jet printing is an emerging technology for printed electronics, offering high‐resolution, noncontact deposition on complex surfaces with broad material compatibility. However, process variability remains a critical challenge in aerosol jet printing, limiting its broader adoption for industrial applications. In this work, a multiparameter closed‐loop control framework is developed and validated that significantly improves process stability over extended print durations. In situ light scattering measurements are used to monitor aerosol volume fraction in real time and serve as the feedback signal for two independently tuned parallel control loops. Dynamic response testing reveals the temporal characteristics of each control parameter, enabling the design of targeted control strategies. A slow response loop modulates atomizer voltage to suppress long‐term drift in atomization, while a fast response loop adjusts carrier gas flow rate or feed rate to reduce short‐term variability. Compared to open‐loop printing, the multiparameter control approach reduces the relative standard deviation of electrical conductance in printed samples from 42% to 5% and reduces drift from 25% h −1 to 3% h −1 over a three hour print. This work advances process control in aerosol jet printing systems and demonstrates a strategy for improving manufacturing reliability for printed electronics.
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Research context

OpenAlex topics: Nanomaterials and Printing Technologies · Aerosol Filtration and Electrostatic Precipitation · Electrohydrodynamics and Fluid Dynamics

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Mechanical Engineering Iowa State University 1071 Black Engineering Ames Iowa 50011 USA

Funding

Honeywell Federal Manufacturing and Technologies · Office of Naval Research · Division of Civil, Mechanical and Manufacturing Innovation

References (42)

Show source-provided references
1. C.Cooper B.Hughes in2020 Pan Pacific Microelectronics Symposium (Pan Pacific)IEEE HI USA2020.
2. 10.1109/TIM.2022.322501410.1109/TIM.2022.3225014 ↗
3. 10.3390/bioengineering1112128310.3390/bioengineering11121283 ↗
4. 10.1002/admt.20230003010.1002/admt.202300030 ↗
5. 10.1021/acssensors.8b0129310.1021/acssensors.8b01293 ↗
6. 10.3390/bioengineering1207070710.3390/bioengineering12070707 ↗
7. 10.1007/s00170-022-09215-y10.1007/s00170-022-09215-y ↗
8. J. A.Paulsen M.Renn K.Christenson R.Plourde in2012 Future of Instrum. Int. Workshop (FIIW) ProceedingsIEEE Gatlinburg TN USA2012 pp.1.10.1109/FIIW.2012.6378343 ↗
9. 10.1109/TNANO.2018.284163910.1109/TNANO.2018.2841639 ↗
10. 10.1016/j.addma.2021.10232510.1016/j.addma.2021.102325 ↗
11. 10.1016/j.carbon.2015.04.09410.1016/j.carbon.2015.04.094 ↗
12. S.Stoukatch P.Laurent S.Dricot F.Axisa L.Seronveaux D.Vandormael E.Beeckman B.Heusdens J.Destiné in2012 4th Electron. Syst.‐Integr. Technol. Conf. IEEE Gatlinburg TN USA2012 pp.1.10.1109/ESTC.2012.6542067 ↗
13. 10.1109/TCPMT.2024.338046810.1109/TCPMT.2024.3380468 ↗
14. 10.1038/s41528-024-00340-010.1038/s41528-024-00340-0 ↗
15. 10.1016/j.cej.2025.16012210.1016/j.cej.2025.160122 ↗
16. 10.1002/admt.20240211410.1002/admt.202402114 ↗
17. 10.1088/2058-8585/ace3d810.1088/2058-8585/ace3d8 ↗
18. 10.1088/2058-8585/aa5af910.1088/2058-8585/aa5af9 ↗
19. P.Lall A.Abrol N.Kothari B.Leever S.Miller in2019 18th IEEE Intersoc. Conf. on Therm. and Thermomech. Phenom. in Electron. Syst. (ITherm) IEEE Las Vegas NV USA2019 pp.633.10.1109/ITHERM.2019.8757268 ↗
20. 10.1115/1.404853510.1115/1.4048535 ↗
21. Wadhwa A. · J. Print Media Technol. Res. · 2016 · 5 · 207
22. 10.1088/2058-8585/ab6e7410.1088/2058-8585/ab6e74 ↗
23. 10.1115/1.403459110.1115/1.4034591 ↗
24. 10.1115/1.404365910.1115/1.4043659 ↗
25. 10.1088/1361-6439/aa817f10.1088/1361-6439/aa817f ↗
26. 10.1016/j.jmapro.2025.03.06710.1016/j.jmapro.2025.03.067 ↗
27. 10.1080/17452759.2024.242953010.1080/17452759.2024.2429530 ↗
28. 10.1016/j.addma.2024.10420810.1016/j.addma.2024.104208 ↗
29. 10.1016/j.jmapro.2025.08.04810.1016/j.jmapro.2025.08.048 ↗
30. 10.1088/2058-8585/ad1dbf10.1088/2058-8585/ad1dbf ↗
31. 10.1002/admt.20200078110.1002/admt.202000781 ↗
32. 10.1002/adem.20220191910.1002/adem.202201919 ↗
33. 10.1016/j.jmapro.2025.08.02310.1016/j.jmapro.2025.08.023 ↗
34. Rurup J. D. · American Society Of Mechanical Engineers Digital Collection · 2024 · 88469
35. 10.1016/j.addma.2021.10202810.1016/j.addma.2021.102028 ↗
36. 10.1088/2058-8585/aba2bb10.1088/2058-8585/aba2bb ↗
37. 10.1088/2058-8585/ae004910.1088/2058-8585/ae0049 ↗
38. 10.1002/adem.20240271510.1002/adem.202402715 ↗
39. 10.1088/2058-8585/aace2810.1088/2058-8585/aace28 ↗
40. 10.1002/smsc.20250006910.1002/smsc.202500069 ↗
41. 10.1038/s41586-023-05898-910.1038/s41586-023-05898-9 ↗
42. 10.1002/adma.20241420310.1002/adma.202414203 ↗