journal article·2025-09Open access

How to Manufacture Photonic Metamaterials

Apurba Paul, Gregory Timp

Advanced Materials Technologies· Volume 10· Issue 18

Abstract

Abstract Metamaterials, which started off focused on optical and electromagnetic applications such as invisibility and “hyperlenses” with resolution beyond the diffraction limit, has now broadened in scope to include pretty much everything from wireless communications (antennas), lasers, computing, solar power, sports equipment, medicine; acoustics, structural mechanics and even air conditioning. Yet, the promises derived from these applications have not been exploited in earnest and the market for them has not grown much so far, likely because a facile and economical method for fabricating them without defect has not emerged. This review scrutinizes the methods used to manufacture metamaterials with the aim to remedy this shortcoming.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Metamaterials and Metasurfaces Applications · Photonic Crystals and Applications · Plasmonic and Surface Plasmon Research

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Electrical Engineering University of Notre Dame Notre Dame IN 46556 USA

Department of Electrical Engineering and Biological Science University of Notre Dame Notre Dame IN 46556 USA

Funding

Defense Sciences Office, DARPA

References (100+)

Show source-provided references
1. 10.1038/ncomms440210.1038/ncomms4402 ↗
2. 10.1063/1.470943610.1063/1.4709436 ↗
3. 10.1021/acs.nanolett.0c0370810.1021/acs.nanolett.0c03708 ↗
4. 10.1126/science.125321310.1126/science.1253213 ↗
5. 10.1002/adma.20090160110.1002/adma.200901601 ↗
6. 10.1364/OL.40.00398610.1364/OL.40.003986 ↗
7. 10.1126/science.117703110.1126/science.1177031 ↗
8. 10.1103/PhysRevB.79.12110410.1103/PhysRevB.79.121104 ↗
9. 10.1038/nature0724710.1038/nature07247 ↗
10. 10.1002/adma.20100242910.1002/adma.201002429 ↗
11. 10.1002/adma.20240134410.1002/adma.202401344 ↗
12. 10.1021/nn402736f10.1021/nn402736f ↗
13. 10.1126/science.115756610.1126/science.1157566 ↗
14. 10.1364/OL.34.00250110.1364/OL.34.002501 ↗
15. 10.1038/nmat469410.1038/nmat4694 ↗
16. 10.1002/adma.20050197310.1002/adma.200501973 ↗
17. 10.1038/nmat456110.1038/nmat4561 ↗
18. Hunt B. J. · 1991
19. 10.1098/rspl.1898.004610.1098/rspl.1898.0046 ↗
20. 10.1070/PU1968v010n04ABEH00369910.1070/PU1968v010n04ABEH003699 ↗
21. 10.1103/PhysRevLett.76.477310.1103/PhysRevLett.76.4773 ↗
22. 10.1088/0953-8984/10/22/00710.1088/0953-8984/10/22/007 ↗
23. 10.1109/22.79800210.1109/22.798002 ↗
24. https://www.imarcgroup.com/metamaterials‐market(accessed: May 2025).
25. a)D.Patel A.Ahmad “TSMC 3nm FinFlex + Self‐Aligned Contacts Intel EMIB 3 + Foveros Direct AMD Yield Issues IBM Vertical Transport FET (VTFET) + RU Interconnects CFET Sequential Stacking Samsung Yield and more //IEDM 2022 Round‐Up ” https://semianalysis.com/2023/02/02/iedm2022p1/(accessed: February 2023);
26. 10.1109/JEDS.2019.293457510.1109/JEDS.2019.2934575 ↗
27. https://www.macrumors.com/2024/09/19/kuo‐iphone‐17‐3nm‐chips/(accessed: May 2025).
28. https://www.anandtech.com/show/16041/where‐are‐my‐gaafets‐tsmc‐to‐stay‐with‐finfet‐for‐3nm(accessed: May 2025).
29. C‐H.Chang V. S.Chang K. H.Pan K. T.Lai J. H.Lu J. A.Ng C. Y.Chen B. F.Wu C. J.Lin C. S.Liang C. P.Tsao Y. S.Mor C. T.Li T. C.Lin C. H.Hsieh P. N.Chen H. H.Hsu J. H.Chen H. F.Chen J. Y.Yeh M. C.Chiang C. Y.Lin J. J.Liaw C. H.Wang S. B.Lee C. C.Chen H. J.Lin R.Chen K. W.Chen C. O.Chui presented at2022 Int. Electron Devices Meeting (IEDM) San Francisco CA USA December2022 https://doi.org/10.1109/IEDM45625.2022.10019565(accessed: May 2025).
30. 10.1038/s41427-019-0129-710.1038/s41427-019-0129-7 ↗
31. 10.1109/PROC.1986.1368610.1109/PROC.1986.13686 ↗
32. 10.1109/MDT.2005.13610.1109/MDT.2005.136 ↗
33. K.Bernstein R.Puri A.Young P.Andry J.Cann P.Emma D.Greenberg W.Haensch M.Ignatowski S.Koester J.Magerlein inProc. of the 44th Annual Conf. on Design Automation – DAC ’07 ACM Press San Diego California 2007 p.562–567.10.1145/1278480.1278623 ↗
34. 10.1109/LED.2006.87342410.1109/LED.2006.873424 ↗
35. https://www.tomshardware.com/tech‐industry/tsmcs‐wafer‐pricing‐now‐usd18‐000‐for‐a‐3nm‐wafer‐increased‐by‐over‐3x‐in‐10‐years‐analyst(accessed: May 2025).
36. https://www.construction‐physics.com/p/how‐to‐build‐a‐20‐billion‐semiconductor(accessed: May 2024).
37. 10.1109/4.6570410.1109/4.65704 ↗
38. https://www.trendforce.com/news/2024/09/12/news‐samsungs‐2nm‐yield‐rate‐at‐most‐20‐withdraws‐personnel‐from‐texas‐taylor‐plant/(accessed: May 2025).
39. https://www.statista.com/outlook/tmo/semiconductors/integrated‐circuits/worldwide(accessed: May 2025).
40. 10.1038/s41586-021-03819-210.1038/s41586-021-03819-2 ↗
41. 10.1038/s41592-024-02272-z10.1038/s41592-024-02272-z ↗
42. 10.1038/s42256-024-00809-710.1038/s42256-024-00809-7 ↗
43. https://magazine.hms.harvard.edu/articles/did‐ai‐solve‐protein‐folding‐problem(accessed: May 2025).
44. 10.1126/science.107082110.1126/science.1070821 ↗
45. 10.1038/385321a010.1038/385321a0 ↗
46. 10.1126/science.249.4970.74910.1126/science.249.4970.749 ↗
47. 10.1063/1.151935610.1063/1.1519356 ↗
48. 10.1126/science.290.5499.212610.1126/science.290.5499.2126 ↗
49. 10.1021/ma981538g10.1021/ma981538g ↗
50. 10.1152/physrev.00027.201110.1152/physrev.00027.2011 ↗
51. 10.1111/j.1742-4658.2006.05181.x10.1111/j.1742-4658.2006.05181.x ↗
52. 10.1038/3500809610.1038/35008096 ↗
53. 10.1001/jama.2020.116610.1001/jama.2020.1166 ↗
54. https://amr.solutions/2020/03/06/what‐does‐an‐antibiotic‐cost‐to‐develop‐what‐is‐it‐worth‐how‐to‐afford‐it/(accessed: May 2025).
55. 10.1103/PhysRevB.62.151610.1103/PhysRevB.62.1516 ↗
56. Jorgenson R. E. · Sandia Rep. · 2006 · 6833
57. 10.3390/ma1316360510.3390/ma13163605 ↗
58. Zadpoor A. A. · Appl. Phys. Lett. Mater. · 2023 · 11
59. 10.1038/s41566-021-00793-z10.1038/s41566-021-00793-z ↗
60. 10.1126/science.aag247210.1126/science.aag2472 ↗
61. 10.1038/nphoton.2017.14210.1038/nphoton.2017.142 ↗
62. 10.1038/nnano.2015.30410.1038/nnano.2015.304 ↗
63. 10.1038/nphoton.2011.15410.1038/nphoton.2011.154 ↗
64. 10.1039/c0cs00184h10.1039/c0cs00184h ↗
65. 10.3390/nano1206102710.3390/nano12061027 ↗
66. 10.1038/s42254-018-0018-y10.1038/s42254-018-0018-y ↗
67. 10.3390/mi1210114210.3390/mi12101142 ↗
68. 10.1039/D2MA00497F10.1039/D2MA00497F ↗
69. 10.1515/nanoph-2022-067110.1515/nanoph-2022-0671 ↗
70. 10.1038/natrevmats.2016.110.1038/natrevmats.2016.1 ↗
71. 10.1002/adem.20180086410.1002/adem.201800864 ↗
72. Gangwar K. · Adv. Electron. Elec. Eng. · 2014 · 4 · 97
73. 10.3390/s2015410810.3390/s20154108 ↗
74. 10.1016/j.addma.2020.10156210.1016/j.addma.2020.101562 ↗
75. 10.1007/s12200-021-1121-810.1007/s12200-021-1121-8 ↗
76. Suy V‐C. · Opt. Express · 2018 · 26
77. 10.1021/acsphotonics.7b0118210.1021/acsphotonics.7b01182 ↗
78. 10.37188/lam.2024.00510.37188/lam.2024.005 ↗
79. 10.3389/fphy.2022.89379110.3389/fphy.2022.893791 ↗
80. Zhao X. · Adv. Dev. Instru. · 2022 · 2022
81. 10.1364/OE.19.00960710.1364/OE.19.009607 ↗
82. 10.1103/PhysRevLett.99.01740110.1103/PhysRevLett.99.017401 ↗
83. 10.1002/adma.20080330210.1002/adma.200803302 ↗
84. 10.1002/hlca.20089025310.1002/hlca.200890253 ↗
85. 10.1038/nature0458610.1038/nature04586 ↗
86. 10.1126/sciadv.adj810310.1126/sciadv.adj8103 ↗
87. 10.1021/acs.chemrev.7b0036410.1021/acs.chemrev.7b00364 ↗
88. 10.1002/adma.20200180610.1002/adma.202001806 ↗
89. 10.1364/OME.2.00026910.1364/OME.2.000269 ↗
90. 10.1038/nature0193510.1038/nature01935 ↗
91. 10.1126/science.327.5962.13810.1126/science.327.5962.138 ↗
92. 10.1103/PhysRevLett.69.163610.1103/PhysRevLett.69.1636 ↗
93. 10.1126/science.262.5135.87710.1126/science.262.5135.877 ↗
94. 10.1016/S0167-9317(96)00116-510.1016/S0167-9317(96)00116-5 ↗
95. 10.1209/epl/i1999-00237-510.1209/epl/i1999-00237-5 ↗
96. 10.1364/OL.20.00253510.1364/OL.20.002535 ↗
97. 10.1063/1.47420610.1063/1.474206 ↗
98. 10.1103/PhysRevLett.85.270510.1103/PhysRevLett.85.2705 ↗
99. 10.1063/1.114888310.1063/1.1148883 ↗
100. 10.1016/S0030-4018(02)01524-910.1016/S0030-4018(02)01524-9 ↗