Liquid Metal‐Coated Textile with P(AAm‐co‐AA) Ionogel Encapsulation to Mitigate Electromagnetic Radiation Pollution
Source abstract
Abstract
Abstract Conductive textiles with electromagnetic interference (EMI) shielding functionality are highly desirable for growing flexibility requirements of EMI shielding devices. Most extant shielding coatings on textiles rely on rigid nanomaterials, which are susceptible to detachment, and generate a great deal of reflected EM waves. Thus, there is a high demand for shielding coatings on textiles that are stretchable, stable, and capable of suppressing the secondary reflection toward incident EM waves. Liquid metal is a particularly suitable candidate owing to its high electrical conductivity and excellent conformality. Herein, a straightforward coating strategy is developed for fast fabrication of Ion/Clay‐F that is reinforced with ionogel encapsulation. Especially, the method enables the direct transformation of fluid‐like liquid metal into a clay‐like state and the preparation of ionogel sealings from monomer solutions. The resulting Ion/Clay‐F exhibits promising features, including high total EMI shielding effectiveness (SET) (highest value of 49.3 dB for a single layer and an average value of 73.0 dB for three layers), low reflectivity (0.404), improved tensile strength (13.16 MPa) and tolerance in a wide range of temperatures (−18–100 °C). Remarkably, such Ion/Clay‐F outperforms pure cotton fabric in terms of thermal management, delivering superior heat dissipation and thermal insulation properties.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electromagnetic wave absorption materials · Advanced Sensor and Energy Harvesting Materials · Textile materials and evaluations
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Textiles Donghua University Shanghai 201600 China
Key Laboratory of Textile Science and Technology Ministry of Education Shanghai 201600 China
Textile Technology Innovation Center Donghua University Shanghai 201620 China
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