3D Printing by Two‐Photon Polymerization of Polyimide Objects and Demonstration of a 3D‐printed Micro‐Hotplate
Source abstract
Abstract
Abstract Polyimides are polymeric materials with outstanding thermal, chemical, and mechanical properties. For this reason, they find applications in several engineering sectors, including aerospace, microsystems, and biomedical applications. For realizing 3D structures made of polyimides, 3D printing is an attractive technique because it overcomes the limitations of polyimide processing using conventional manufacturing techniques such as molding and subtractive manufacturing. However, current polyimide 3D printing approaches are limited to realizing objects with the smallest dimensions of the order of a few hundred micrometers. 3D printing of polyimide objects featuring sub‐micrometer resolution using two‐photon polymerization by direct laser writing is demonstrated here. A negative photosensitive polyimide is applied that is widely used in microsystems applications. To demonstrate the utility of this polyimide 3D printing approach and the compatibility of the 3D objects with operation at elevated temperatures, a micro‐hotplate is 3D printed and characterized at operating temperatures of above 300 °C.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Nonlinear Optical Materials Studies · Nanofabrication and Lithography Techniques · Synthesis and properties of polymers
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
KTH Royal Institute of Technology Division of Micro and Nanosystems Malvinas väg 10 Stockholm 10044 Sweden
Senseair AB Research Department Färögatan 33, Kista Stockholm 16451 Sweden
References (41)
Show source-provided references
1. 10.1016/j.progpolymsci.2012.02.00510.1016/j.progpolymsci.2012.02.005 ↗
2. 10.1109/TCPMT.2012.218840210.1109/TCPMT.2012.2188402 ↗
3. 10.1002/adma.20180607010.1002/adma.201806070 ↗
4. 10.3390/ma1219316610.3390/ma12193166 ↗
5. DuPont http://www2.dupont.com/Kapton/en_US/assets/downloads/pdf/Gen_Specs.pdf(accessed: September 2017)
6. 10.1002/adma.20170124010.1002/adma.201701240 ↗
7. 10.1021/acsmacrolett.8b0012610.1021/acsmacrolett.8b00126 ↗
8. 10.1039/C7TA01952A10.1039/C7TA01952A ↗
9. 10.1021/acsami.8b1458410.1021/acsami.8b14584 ↗
10. 10.1016/j.matlet.2018.07.02010.1016/j.matlet.2018.07.020 ↗
11. H.Araki Y.Shoji Y.Masuda K.Hashimoto;K.Matsumura;Y.Koyama;M.Tomikawa 2018 Int. Wafer Level Packaging Conf. (IWLPC) San Jose CA USAOctober2018.
12. 10.1007/s11431-016-0266-610.1007/s11431-016-0266-6 ↗
13. 10.3390/polym1406126910.3390/polym14061269 ↗
14. 10.1116/1.149481610.1116/1.1494816 ↗
15. 10.1295/polymj.PJ200717810.1295/polymj.PJ2007178 ↗
16. 10.1038/3508913010.1038/35089130 ↗
17. 10.1016/j.addma.2023.10347410.1016/j.addma.2023.103474 ↗
18. 10.1063/1.161025310.1063/1.1610253 ↗
19. 10.3389/fbioe.2022.99435510.3389/fbioe.2022.994355 ↗
20. 10.1038/s41378-022-00440-910.1038/s41378-022-00440-9 ↗
21. 10.1038/s41563-021-01111-210.1038/s41563-021-01111-2 ↗
22. 10.1038/s41467-023-38996-310.1038/s41467-023-38996-3 ↗
23. 10.1038/s41378-019-0079-910.1038/s41378-019-0079-9 ↗
24. HD Microsystems GmbH.https://www.hdmicrosystems.com/products/hd‐4100‐series.html(accessed: May 2018)
25. 10.3390/micro102001310.3390/micro1020013 ↗
26. 10.1038/s41598-020-67184-210.1038/s41598-020-67184-2 ↗
27. 10.1364/OE.21.02624410.1364/OE.21.026244 ↗
28. 10.1115/1.403644510.1115/1.4036445 ↗
29. 10.3390/mi804010110.3390/mi8040101 ↗
30. 10.1016/j.addma.2021.10249110.1016/j.addma.2021.102491 ↗
31. 10.1088/1361-6439/aa5d7010.1088/1361-6439/aa5d70 ↗
32. F.Reverter T.Prodromakis Y.Liu P.Georgiou K.Nikolic T.Constandinou IEEE Int. Sym. on Circuits and Systems Melbourne VIC Australia June2014.
33. 10.1021/acsnano.5b0279010.1021/acsnano.5b02790 ↗
34. 10.1038/ncomms255310.1038/ncomms2553 ↗
35. 10.1016/j.snb.2014.08.07710.1016/j.snb.2014.08.077 ↗
36. 10.1109/84.66139510.1109/84.661395 ↗
37. 10.1016/j.sna.2022.11381110.1016/j.sna.2022.113811 ↗
38. Y.Moser M. A. M.Gijs presented atTRANSDUCERS and EUROSENSORS ’07 –4th Int. Conf. on Solid‐State Sensors Actuators and Microsystems Lyon France June2007.
39. HD Microsystems GmbH Ref. 1300000306 Version 9.0 2019.
40. Xu L. · Mater Sci Eng · 2020 · 711
41. 10.2494/photopolymer.29.25110.2494/photopolymer.29.251 ↗