Fabrication and Characterization of a Thermoelectric Generator with High Aspect Ratio Thermolegs for Electrically Active Implants
Source abstract
Abstract
Implantable thermoelectric generators hold significant promise as an alternative or supplementary energy source for implantable medical devices, but their performance is constrained by spatial limitations within implants and relies heavily on design optimization. In this study, an optimized thermoelectric generator featuring high aspect ratio thermolegs (0.5 × 0.5 × 4 mm3) is presented, which achieves a remarkable power output of 110 µW with a simulated temperature difference (3 K) in an implantation scenario. This achievement is realized through the use of a removable assembly rig during the soldering process, streamlining the fabrication process. Furthermore, the integration of a boost converter within the thermoelectric generator results in a voltage output of 2.5 V, addressing the voltage requirements of active implants. These findings highlight the potential that implantable thermoelectric generators can be used as a reliable, quiet and self‐sufficient power source for implantable medical devices.
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Research context
OpenAlex topics: Advanced Thermoelectric Materials and Devices · Advanced Sensor and Energy Harvesting Materials · Neuroscience and Neural Engineering
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Institute for Electronic Appliances and Circuits University of Rostock 18059 Rostock Germany
Department of Engineering Jade University of Applied Sciences 26389 Wilhelmshaven Germany
Leibniz Institute for Solid State and Materials Research 01069 Dresden Germany <?vsp 1pt?>
References (36)
Show source-provided references
1. 10.1111/j.1540-8159.2003.00364.x10.1111/j.1540-8159.2003.00364.x ↗
2. 10.1049/piee.1978.024710.1049/piee.1978.0247 ↗
3. 10.1016/j.apenergy.2022.11869610.1016/j.apenergy.2022.118696 ↗
4. Du C. · Adv. Funct. Mater. · 2022 · 32 · 36
5. 10.1002/adfm.20230386110.1002/adfm.202303861 ↗
6. 10.1002/adfm.20211143510.1002/adfm.202111435 ↗
7. 10.1016/j.nanoen.2021.10626010.1016/j.nanoen.2021.106260 ↗
8. 10.1016/j.enconman.2021.11516710.1016/j.enconman.2021.115167 ↗
9. 10.1016/j.energy.2022.12503210.1016/j.energy.2022.125032 ↗
10. 10.1039/D2TA06966K10.1039/D2TA06966K ↗
11. 10.1016/j.seta.2019.10060410.1016/j.seta.2019.100604 ↗
12. 10.1016/S0378-7753(01)00648-610.1016/S0378-7753(01)00648-6 ↗
13. 10.1002/adhm.20200077910.1002/adhm.202000779 ↗
14. 10.1109/TPEL.2022.316489010.1109/TPEL.2022.3164890 ↗
15. 10.1088/0022-3727/40/18/04210.1088/0022-3727/40/18/042 ↗
16. 10.1016/j.microrel.2022.11484310.1016/j.microrel.2022.114843 ↗
17. 10.1109/JMEMS.2009.202110410.1109/JMEMS.2009.2021104 ↗
18. 10.1038/s41928-022-00776-010.1038/s41928-022-00776-0 ↗
19. A.Chen Phd Thesis University of California 2011.
20. Leonov V. · 2007 · 10
21. D.Vasilevskiy N.Kukhar S.Turenne R. A.Masut Hot extruded (Bi Sb) 2 (Te Se) 3 alloys for advanced thermoelectric modules. Oral presentation 5th Eur. Conf. Thermoelectrics 2007.
22. 10.1557/jmr.2012.2710.1557/jmr.2012.27 ↗
23. 10.1002/cnm.351710.1002/cnm.3517 ↗
24. British Heart Foundation From the procedure to recovery: Frequently asked pacemaker questions https://www.bhf.org.uk/informationsupport/heart‐matters‐magazine/medical/how‐does‐a‐pacemaker‐work/frequently‐asked‐pacemaker‐questions(accessed: September 2023).
25. TEC Microsystems Hot‐extruded bite material in ingots https://www.tec‐microsystems.com/products/bite‐material‐in‐ingots.html(accessed: September 2023).
26. Council of the European Union Council Directive 90/385/EEC https://eur‐lex.europa.eu/legal‐content/EN/ALL/?uri=CELEX%3A31990L0385(accessed: Septmeber 2023).
27. British Standards Institution BS EN 45502‐1 https://www.en‐standard.eu/bs‐en‐45502‐1‐2015‐implants‐for‐surgery‐active‐implantable‐medical‐devices‐general‐requirements‐for‐safety‐marking‐and‐for‐information‐to‐be‐provided‐by‐the‐manufacturer/(accessed: September 2023).
28. International Organization for Standardization ISO 14708‐1 August 2014.
29. F.Boeser J. S.Ordonez M.Schuettler T.Stieglitz D. T.Plachta inNon-hermetic encapsulation for implantable electronic devices based on epoxy." In 2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) IEEE 2015 pp.809–81210.1109/EMBC.2015.7318485 ↗
30. 10.1088/0960-1317/16/8/01610.1088/0960-1317/16/8/016 ↗
31. M.Tencer Moisture ingress into nonhermetic enclosures and packages A quasi-steady state model for diffusion and attenuation of ambient humidity variationsIn 1994 Proceedings. 44th Electron. Compon. Technol. Conf IEEE 1994 pp.196–209.10.1109/ECTC.1994.367630 ↗
32. 10.1109/TCPMT.2012.221042510.1109/TCPMT.2012.2210425 ↗
33. 10.1109/TBME.2011.213634110.1109/TBME.2011.2136341 ↗
34. 10.1016/j.enconman.2007.09.01510.1016/j.enconman.2007.09.015 ↗
35. 10.1109/JMEMS.2010.204998510.1109/JMEMS.2010.2049985 ↗
36. 10.4071/imaps.41710.4071/imaps.417 ↗