journal article·2019-10

A Structured Design for Highly Stretchable Electronic Skin

Jinsheng Zhao, Can Zhang, Dan Zou, Xiaokun Liu, Lixun Cai, Xiangyu Li, Mingxing Shi

Advanced Materials Technologies· Volume 4· Issue 10
Publisher page

Abstract

Abstract The sensation of pressure is at the core of haptics, and can be achieved by pressure sensors in an electronic skin. Although a number of multifunctional sensors can be fabricated by adopting diverse microstructures and functional materials, achieving electronic skin with superior sensing capabilities under large‐scale deformations is challenging. A highly stretchable electronic skin based on a structured design is proposed and fabricated. It exhibits stable response and long‐term durability in sensing pressure due to improved strain isolation and restrained interfacial failure, in situations nearly regardless of what large‐scale deformations the electronic skins may undergo, such as stretching, bending, or even twisting. Experimental studies and finite element analyses show that their mechanical properties allow these electronic skins to function during large motions including bending states of fingers and wrists. The advanced development of electronic skin demonstrates potential applications in intelligent robots, bionic prostheses, health monitoring, human–machine interfaces, and other fields.
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Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Tactile and Sensory Interactions · Muscle activation and electromyography studies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Applied Mechanics and Structure Safety Key Laboratory of Sichuan Province School of Mechanics and Engineering Southwest Jiaotong University Key Laboratory of Advanced Technologies of Materials Ministry of Education of China Chengdu 610031 China

School of Materials Science and Engineering Southwest Jiaotong University Chengdu 610031 China

School of Mechanics and Engineering Southwest Jiaotong University Chengdu 610031 China

Funding

National Natural Science Foundation of China

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