One‐Step Selective Adhesive Transfer Printing for Scalable Fabrication of Stretchable Electronics

Abstract Transferring patterned thin foil structures onto an elastic substrate is one important process for realizing heterogeneous integration and high‐performance stretchable electronics. Usually, specific equipment and long learning curve are necessary for transferring fragile micro/nanostructures. In this work, a one‐step selective transfer printing technique can selectively transfer fine metal structure from a donor substrate to a sticky polydimethylsiloxane receiver by tuning its adhesion force and hence corresponded energy release rate (G). The method greatly simplifies the transferring process compared with traditional ones. The selective transferring lies in the fact that a wider line requires a higher energy release rate, based on experimental and numerical analysis. With the selective adhesive transferring technique, a few simple stretchable devices and structures are fabricated, where a device does not exhibit any fatigue after stretching for 10 000 cycles under a 40% strain. Further, this method does not use any new specific equipment and is believed to be a reliable and cost‐effective technique for potential mass production of stretchable electronics.