journal article·2019-02Open access

Adhesion‐Free Thin‐Film‐Like Curvature Sensors Integrated on Flexible and Wearable Electronics for Monitoring Bending of Joints and Various Body Gestures

Hao Liu, Hongyu Zhao, Shuang Li, Jianqiao Hu, Xinran Zheng, Rui Li, Yuli Chen, Yewang Su

Advanced Materials Technologies· Volume 4· Issue 2

Abstract

Abstract Flexible and wearable electronics integrated with various sensors have great potential for applications in monitoring human activities and personal health. Bending and tension/compression dominate the deformation modes yielded by flexure of joints and diverse body gestures. A key challenge now is to sense the curvature/bending angle, while much research has been focused on the strain sensors for tension/compression. Alternative approaches by strain sensors or noncontact optical methods for curvature sensing are not practical for wearable electronics. A novel adhesion‐free thin‐film‐like curvature sensor that can monitor bending activities is introduced for flexible and wearable electronics. This study presents comprehensive design, fabrication, mechanism, structural analysis, performance characterization, and device‐level demonstrations for bending of joints, gesture recognition, and real‐time sitting posture correction. The most prominent advantage of the present sensor is that the measurement is independent of the strain of the target surface and the interfacial slippage, thus the perfect adhesion between the sensor and the surface is unnecessary. The features of adhesion‐free, simple mechanical principle, low cost, and satisfactory monitoring results highlight the superiority of the present curvature sensors for practical applications to flexible and wearable electronics.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Tactile and Sensory Interactions · Adhesion, Friction, and Surface Interactions

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

State Key Laboratory of Nonlinear Mechanics Institute of Mechanics Chinese Academy of Sciences Beijing 100190 China

Institute of Solid Mechanics Beihang University (BUAA) Beijing 100191 China

School of Engineering Science University of Chinese Academy of Sciences Beijing 100049 China

State Key Laboratory of Structural Analysis for Industrial Equipment Department of Engineering Mechanics and International Research Center for Computational Mechanics Dalian University of Technology Dalian 116024 China

Department of Civil and Environmental Engineering Northwestern University Evanston IL 60208 USA

Funding

National Natural Science Foundation of China · Chinese Academy of Sciences · Program for New Century Excellent Talents in University

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