Room Temperature Electronic Functionalization of Thermally Sensitive Substrates by Inkjet Printing of a Reactive Silver‐Based MOD Ink

Abstract The developments in inkjet printing technology and the printed electronics industry in the past two decades have provided cost‐effective, environment‐friendly, and reliable alternates to traditional methods of fabricating electrical devices. However, most commercial metallic inks require high sintering temperatures to form desired functional patterns, which limits the applications of printed electronics in scenarios that require electrical devices on thermally sensitive substrates, like biomaterials or bio‐synthetic composite materials. This study provides the synthetic route of a novel silver‐based metal organic decomposition (MOD) ink which is used to form highly conductive silver films on the thermally sensitive skin‐inspired silk/epoxy composite substrates by directly inkjet printing with accurate pattern control, whilst self‐decomposing and sintering at room temperature. The fabricated silver patterns on the thermally sensitive silk/epoxy composite substrate are highly conductive with conductivity of 4.65 × 10⁴ S m⁻¹. These silver patterns also show impressive malleability as bulk silver films, which can be further developed into motion sensors for wearable devices or medical applications. Our strategy provides a general platform for electronic functionalization without temperature constraints. The particle‐free, reactive silver‐precursor, and lower sintering temperature of the ink also widen the choices of substrates, as exemplified herein with outstanding printing quality and high electrical conductivity (1.20 × 10⁶ S m⁻¹) also achieve on paper.