Highly Efficient, Flexible Wireless‐Powered Circuit Printed on a Moist, Soft Contact Lens
Source abstract
Abstract
Abstract Contact lens with built‐in electronics is a next‐generation wearable product with potential applications such as biomedical sensing and wearable displays. However, fabricating a wireless‐powered circuit on a moist, soft contact lens, via common dry lithography, makes producing smart contact lenses challenging. Here, electrochemically (EC) printing a wireless‐powered circuit onto a moist, soft contact lens is demonstrated. EC printing involves adding a conductive polymer at the interface between a metal contact and a hydrogel‐based contact lens, resulting in strong adhesion of the circuit to the lens without losing high power transfer efficiency (50%) from an eyeglass transmitter to the printed receiver lens. The energy transfer characteristics during eye movement are modeled using the Neumann equation and Kirchhoff's voltage law for wireless power transfer. The energy transfer efficiency between the eyeglass transmitter and the printed receiver lens is derived, and illumination of a wireless‐powered single light‐emitting diode display as a function of eye rotation angle is demonstrated. This work opens the door to integrating more complex circuits at soft contact lens interface to produce smart contact lens with increased functionality.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Wireless Power Transfer Systems · Advanced Sensor and Energy Harvesting Materials · Energy Harvesting in Wireless Networks
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Graduate School of Information Production and Systems Waseda University Kitakyushu Fukuoka 808‐0135 Japan
Department of Finemechanics Graduate School of Engineering Tohoku University Sendai 980‐8579 Japan
Funding
Tateishi Science and Technology Foundation · Okawa Foundation for Information and Telecommunications
References (44)
Show source-provided references
1. 10.1097/OPX.000000000000084710.1097/OPX.0000000000000847 ↗
2. 10.1002/elan.20150111610.1002/elan.201501116 ↗
3. 10.1002/adhm.20140050410.1002/adhm.201400504 ↗
4. 10.1021/acsnano.8b0082910.1021/acsnano.8b00829 ↗
5. 10.1002/admt.20170007310.1002/admt.201700073 ↗
6. 10.1038/ncomms176710.1038/ncomms1767 ↗
7. 10.1364/OE.26.01155310.1364/OE.26.011553 ↗
8. 10.3390/cryst801002910.3390/cryst8010029 ↗
9. 10.1016/j.displa.2017.05.00510.1016/j.displa.2017.05.005 ↗
10. 10.1088/0960-1317/21/12/12501410.1088/0960-1317/21/12/125014 ↗
11. 10.1109/JSSC.2011.217063310.1109/JSSC.2011.2170633 ↗
12. 10.1007/s10544-011-9530-x10.1007/s10544-011-9530-x ↗
13. 10.1007/s10544-007-9073-310.1007/s10544-007-9073-3 ↗
14. 10.1016/j.snb.2011.12.04910.1016/j.snb.2011.12.049 ↗
15. 10.1002/adfm.20170548010.1002/adfm.201705480 ↗
16. 10.1088/0957-4484/23/34/34400610.1088/0957-4484/23/34/344006 ↗
17. 10.1007/s10544-015-9979-010.1007/s10544-015-9979-0 ↗
18. 10.1038/nbt0914-85610.1038/nbt0914-856 ↗
19. 10.1088/0960-1317/22/7/07500710.1088/0960-1317/22/7/075007 ↗
20. 10.1021/acsnano.7b0037010.1021/acsnano.7b00370 ↗
21. 10.1111/j.1755-3768.2008.01404.x10.1111/j.1755-3768.2008.01404.x ↗
22. Yeh G. T. · IEEE Sens. · 2015 · 291 · 1
23. 10.1016/j.sna.2013.08.02910.1016/j.sna.2013.08.029 ↗
24. 10.1038/ncomms1499710.1038/ncomms14997 ↗
25. 10.1126/sciadv.aap984110.1126/sciadv.aap9841 ↗
26. 10.1002/adma.20170325710.1002/adma.201703257 ↗
27. 10.1021/ac400679310.1021/ac4006793 ↗
28. 10.1016/j.bios.2014.12.03410.1016/j.bios.2014.12.034 ↗
29. 10.1021/mz200240610.1021/mz2002406 ↗
30. 10.1021/ja106235710.1021/ja1062357 ↗
31. 10.3390/en707431610.3390/en7074316 ↗
32. 10.1109/TIE.2003.82203810.1109/TIE.2003.822038 ↗
33. 10.26866/jees.2018.18.1.1310.26866/jees.2018.18.1.13 ↗
34. 10.1109/TMAG.2010.209353410.1109/TMAG.2010.2093534 ↗
35. 10.1109/TPEL.2013.224967010.1109/TPEL.2013.2249670 ↗
36. Mur‐Miranda J. O. · 2010 · 4179
37. Nagaoka H. · J. Coll. Sci., Imp. Univ. Tokyo · 1909 · 27 · 1
38. Ali Z. T. · Int. J. Eng. Sci. Comput. · 2016 · 6 · 5
39. IEEE Std C95.1‐2005 · 2004
40. Arteaga A. P. · 2013
41. Yanoff M. · 2014
42. 10.1097/HP.0b013e3181aff9db10.1097/HP.0b013e3181aff9db ↗
43. 2003
44. Linlin T. · TELKOMNIKA Indones. J. Electr. Eng. · 2013 · 11 · 2747