Recent Development and Applications of Advanced Materials via Direct Ink Writing
Source abstract
Abstract
Abstract Direct ink writing (DIW), a type of extrusion‐based 3D printing method, enables the rapid design and building of size‐ and shape‐scalable 3D structures in a low‐cost and green manner without the need for specific size reactors and secondary substrates compared to traditional synthesis methods. Coupling the use of sol‐gel inks with optimized rheological properties (elastoviscosity and shear stress) and a wide range of nanomaterials enhances the mechanical and electrical conductivity of printed products. In this review, the recent development in DIW methods, critical requirements for printable DIW inks, and applications of DIW‐printed products in medical, energy storage, and environmental treatment are reviewed. A perspective outlook associated with limitations from current DIW research is proposed for the breakthrough development of such technology in the future.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: 3D Printing in Biomedical Research · Advanced Sensor and Energy Harvesting Materials · Additive Manufacturing and 3D Printing Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Faculty of Science and Technology Technological and Higher Education Institute of Hong Kong Hong Kong
School of Environmental Science and Engineering Sun Yat‐Sen University Guangzhou 510006 China
Key Laboratory for Colloid and Interface Chemistry Ministry of Education School of Chemistry and Chemical Engineering Shandong University Jinan 250100 China
Joint Key Laboratory of the Ministry of Education Institute of Applied Physics and Materials Engineering University of Macau Avenida da Universidade Taipa Macau SAR 999078 China
School of Engineering University of East Anglia Norwich Norfolk NR4 7TJ UK
Funding
National Natural Science Foundation of China · National Key Research and Development Program of China · Science and Technology Development Fund · Universidade de Macau · University of East Anglia
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