Freeze‐Printing of Liquid Metal Alloys for Manufacturing of 3D, Conductive, and Flexible Networks
Source abstract
Abstract
In freeze-printing, the liquid metal alloy (EGaIn) is continuously dispensed and frozen along truly 3D curvilinear paths. The printed solid metal network is encapsulated in elastomers to form a flexible composite at room temperature. Freeze-printing can be used to generate high density interconnects, analog circuitry, and antennae for flexible electronic devices. The findings on the fluidic, thermal, and mechanical aspects of freeze-printing are presented. As a service to our authors and readers, this journal provides supporting information supplied by the authors. Such materials are peer reviewed and may be re-organized for online delivery, but are not copy-edited or typeset. Technical support issues arising from supporting information (other than missing files) should be addressed to the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Advanced Materials and Mechanics · Nanomaterials and Printing Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Mechanical and Materials Engineering Washington State University 405 NE Spokane St Pullman WA 99164 USA
Funding
WSU New Faculty Seed Grant 2015
References (46)
Show source-provided references
1. 2014
2. 10.1002/ange.20070364210.1002/ange.200703642 ↗
3. 10.1002/adma.20140033410.1002/adma.201400334 ↗
4. 10.1126/science.116837510.1126/science.1168375 ↗
5. 10.1039/C5LC00742A10.1039/C5LC00742A ↗
6. 10.1063/1.476402010.1063/1.4764020 ↗
7. 10.1002/adfm.20070121610.1002/adfm.200701216 ↗
8. 10.1021/la501202310.1021/la5012023 ↗
9. 10.1021/am504301710.1021/am5043017 ↗
10. 10.1002/adfm.20120240510.1002/adfm.201202405 ↗
11. 10.1088/0964-1726/22/5/05502310.1088/0964-1726/22/5/055023 ↗
12. 10.1177/027836491454379310.1177/0278364914543793 ↗
13. 10.1002/adfm.20150139610.1002/adfm.201501396 ↗
14. 10.1038/srep0344210.1038/srep03442 ↗
15. 10.1039/c3lc50833a10.1039/c3lc50833a ↗
16. 10.1002/adfm.20120358910.1002/adfm.201203589 ↗
17. 10.1039/c2lc40628d10.1039/c2lc40628d ↗
18. 10.3390/s14091631110.3390/s140916311 ↗
19. 10.1002/adma.20140050210.1002/adma.201400502 ↗
20. 10.1002/adfm.20130373210.1002/adfm.201303732 ↗
21. 10.1002/adfm.20130322010.1002/adfm.201303220 ↗
22. 10.1002/adma.20130140010.1002/adma.201301400 ↗
23. 10.1021/la401245d10.1021/la401245d ↗
24. Wang L. · RSC Adv. · 2015 · 5 · 576861
25. 10.1098/rspa.2014.060910.1098/rspa.2014.0609 ↗
26. Kim D. · IEEE Int. Conf. Micro Electro Mech. Syst. · 2014 · 967
27. 10.1002/adma.20140479010.1002/adma.201404790 ↗
28. 10.1002/adma.20150220010.1002/adma.201502200 ↗
29. Chossat J. B. · IEEE Int. Conf. Robot. Autom. · 2015 · 2568
30. 10.1002/adma.20110125710.1002/adma.201101257 ↗
31. 10.1002/adfm.20110196710.1002/adfm.201101967 ↗
32. 10.1002/adfm.20090060410.1002/adfm.200900604 ↗
33. 10.1039/C4LC00762J10.1039/C4LC00762J ↗
34. 10.1016/j.sna.2012.03.02310.1016/j.sna.2012.03.023 ↗
35. 10.1038/srep0178610.1038/srep01786 ↗
36. 10.1007/s11431-014-5657-310.1007/s11431-014-5657-3 ↗
37. 10.1039/C6LC00198J10.1039/C6LC00198J ↗
38. 10.1007/s11431-014-5583-410.1007/s11431-014-5583-4 ↗
39. 10.1109/6104.89507510.1109/6104.895075 ↗
40. 10.1063/1.472431310.1063/1.4724313 ↗
41. Crowe C. T. · 2005 · 379
42. King H. W. · 1963 · 6
43. 10.1016/0022-5088(69)90121-010.1016/0022-5088(69)90121-0 ↗
44. 10.2320/matertrans.MAW20102510.2320/matertrans.MAW201025 ↗
45. Incropera F. P. · 2007
46. 10.1098/rspa.1957.000910.1098/rspa.1957.0009 ↗