Direct Writing of Mesoscale Circuits using Subsonic Cold Spray

Abstract This article reports on work at the Center for Thermal Spray Research over the past 25 years to develop and commercialize a new technology for digital printing of mesoscale circuits directly from a CAD file onto plates, cylinders, and complex 3D components and structures. With the evolution of cold spray technology and new powder materials, as well as advancements in control and robotics, innovative thermal spray applications are on the horizon.