Voids in Electronic Parts Yield to Ultrasound
Source abstract
Abstract
Abstract Acoustic microscopy is an effective method for detecting voids in plastic-encapsulated microcircuit (PEM) packages.
Only a short abstract or summary was supplied by the source.
Source: crossref · Quality: short
Research context
OpenAlex topics: Material Properties and Processing · Recycling and Waste Management Techniques · Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Sonoscan Inc., Elk Grove Village , Illinois
References
Reference metadata was not supplied for this record.