Advancing Diffusion Bonded Compact Heat Exchangers for High Temperature Applications
Source abstract
Abstract
Abstract Enhancement of the diffusion bonding process for the development of compact heat exchangers (CHXs) provides an energy efficient solution for high-temperature applications in advanced nuclear reactors and other technologies. However, available information is limited concerning the diffusion bonding (and manufacturing) of CHXs in high temperature applications and associated selection of bonded materials, bonding conditions, mechanical performance, and thermo-fluid characteristics. This article reviews the available knowledge and the ongoing research being conducted to address gaps in information and application.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Heat Transfer and Optimization · Injection Molding Process and Properties · Nuclear Materials and Properties
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Affiliations
University of Wisconsin–Madison , Madison, Wisconsin
University of Michigan , Ann Arbor, Michigan
Argonne National Laboratory , Lemont, Illinois
Idaho National Laboratory , Idaho Falls, Idaho
University of Illinois , Urbana-Champaign, Illinois
Electric Power Research Institute (EPRI) , Charlotte, North Carolina
Fort Lewis College , Durango, Colorado
MPR Associates Inc.
References
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