Wide‐Field Bond Quality Evaluation Using Frequency Domain Thermoreflectance with Deep Neural Network Feature Reconstruction (Adv. Mater. Interfaces 13/2025)
Source abstract
Abstract
Wide-Field Frequency Domain Thermoreflectance Wide-field (≥1 mm2) frequency-domain thermoreflectance hyperspectral imaging is used to image subsurface indium bump bonds 50 μm below the surface. Thermal analysis enables evaluation of bump quality in a surrogate heterogeneously integrated microelectronic. More details can be found in article 2401039 by Amun Jarzembski, Fabio Semperlotti, and co-workers.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Advanced machining processes and optimization · Metal and Thin Film Mechanics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Sandia National Laboratories Albuquerque New Mexico 87123 USA
Ray W. Herrick Laboratories School of Mechanical Engineering Purdue University West Lafayette Indiana 47906 USA
References
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