Stress‐Free Detachment of Flexible Substrate from Glass Carrier Using CO2 Point Laser for Large‐Area Applications (Adv. Mater. Interfaces 13/2023)
Source abstract
Abstract
Flexible Electronics In article number 2202337, Hyuk Park, Yoonyoung Chung, and colleagues use a roll-to-roll process to fabricate electronic devices on a flexible substrate. Point laser beams are applied along the edge of each device, and they are gently detached from the applied edge by a tensile force generated by the roll curvature. After the laser illumination, the devices are entirely separated from the carrier.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Semiconductor Lasers and Optical Devices · Laser Material Processing Techniques · Advanced Materials and Mechanics
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Affiliations
Department of Electrical Engineering Pohang University of Science and Technology 77 Cheongam‐ro Nam‐gu Pohang Gyeongbuk 37673 Korea
Department of Semiconductor Engineering Center for Semiconductor Technology Convergence Pohang University of Science and Technology 77 Cheongam‐ro Nam‐gu Pohang Gyeongbuk 37673 Korea
References
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