Dual Coil Patterned Ultra‐Thin Silicon Film Enable by Double‐Sided Process (Adv. Mater. Interfaces 16/2023)
Source abstract
Abstract
Double-Sided Microfabrication Handling ultra-thin silicon (UTS) has been challenging and current techniques are mostly limited to bonding UTS to another substrate. In article number 2300158, Chang Hee Son, Sangyeop Lee, Placid M. Ferreira, and Seok Kim introduce a unique technology for freely handling UTS which enables double-sided processing. They fabricated a dual coil on UTS and demonstrated it functioning as an actuator reflecting a laser beam and also acting as an energy harvester.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: 3D IC and TSV technologies · Fluid Dynamics and Thin Films · Electronic Packaging and Soldering Technologies
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Affiliations
Department of Mechanical Science and Engineering University of Illinois at Urbana‐Champaign Urbana IL 61801 USA
Department of Mechanical Engineering Pohang University of Science and Technology Pohang 37673 South Korea
Institute for Convergence Research and Education in Advanced Technology Yonsei University Seoul 03722 South Korea
References
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