Microchannels: High‐Aspect‐Ratio Parallel‐Plate Microchannels Applicable to Kinetic Analysis of Chemical Vapor Deposition (Adv. Mater. Interfaces 16/2016)
Source abstract
Abstract
Kohei Shima and co-workers develop a very deep microchannel with aspect ratio ≥ 1000:1 as a test structure for kinetic analysis and process development of chemical vapor deposition (CVD) in article 1600254. When CVD is conducted into the microchannel, the sticking probability of film-forming species can be detected in the range from 1 down to the order of 10−7, by analyzing the film-thickness gradient.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Metal and Thin Film Mechanics · Copper Interconnects and Reliability · Surface Modification and Superhydrophobicity
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Affiliations
Department of Materials Engineering The University of Tokyo 7‐3‐1 Hongo Bunkyo Tokyo 113‐8656 Japan
Advanced Applied Science Department Research Laboratory IHI Corporation 1, Shin‐Nakahara Isogo Yokohama Kanagawa 235‐8501 Japan
References
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