journal article·2025-05Open access

High‐Yield, Cost‐Effective Fabrication of High‐Aspect‐Ratio Polyimide Microstructures for Robust Superhydrophobic Surfaces

Jinpyeo Jeung, Inyeol Yun, Hyuk Park, Yoonyoung Chung

Advanced Materials Interfaces· Volume 12· Issue 10

Abstract

Abstract Superhydrophobic surfaces (SHS), with their exceptional water‐repellent properties, have attracted great interest due to their versatile applications. The robustness of SHS has emerged as an essential issue for practical applications, as SHS are directly exposed to various harsh environments, such as continuous raindrop impact, corrosive media, and extreme temperatures. Polyimide (PI) is an ideal candidate for robust SHS due to its superior mechanical, thermal, and chemical properties. However, the low processability of PI in surface microstructuring has limited its application in SHS. In this study, a high‐yield and cost‐effective fabrication method for constructing high‐aspect‐ratio PI microstructures has been developed by controlling the template surface treatment, precursor molecular weight, and vacuum process. This approach achieves an exceptional yield rate of 99.8% and an aspect ratio of 10.7, enabling the construction of various microstructures. The SHS is demonstrated by fabricating microstructures on PI surfaces using the proposed method. The PI SHS exhibits a water contact angle of up to 162° and a roll‐off angle of less than 9°. The water repellency withstands 100 tape peeling tests and remains stable after continuous exposure to temperatures up to 250 °C and various chemical reagents for 60 days, which presents excellent robustness against environmental factors.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Surface Modification and Superhydrophobicity · Synthesis and properties of polymers · Advanced Sensor and Energy Harvesting Materials

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Electrical Engineering Pohang University of Science and Technology (POSTECH) 77 Cheongam‐ro Nam‐gu Pohang Gyeongbuk 37673 Republic of Korea

Department of Semiconductor Engineering Pohang University of Science and Technology (POSTECH) 77 Cheongam‐ro Nam‐gu Pohang Gyeongbuk 37673 Republic of Korea

Center for Semiconductor Technology Convergence Pohang University of Science and Technology (POSTECH) 77 Cheongam‐ro Nam‐gu Pohang Gyeongbuk 37673 Republic of Korea

Funding

National Research Foundation · Ministry of Science and ICT, South Korea

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