Flexible Electronics: A General Surface Swelling‐Induced Electroless Deposition Strategy for Fast Fabrication of Copper Circuits on Various Polymer Substrates (Adv. Mater. Interfaces 14/2017)
Source abstract
Abstract
Professor Shengyang Tao and his research group at Dalian University of Technology have succeeded in implementing a simple yet efficient surface swelling-induced strategy for the fabrication of flexible cirxuits. A writing and electroless deposition method is combined to configure conductive copper patterns on the surface of different polymers in article number 1700052.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials
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Affiliations
Department of Chemistry Dalian University of Technology Dalian 116024 China
State Key Lab of Fine Chemicals School of Chemical Engineering, Liaoning Key Lab for Energy Materials and Chemical Engineering Dalian University of Technology Dalian 116024 China
References
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