journal article·2022-06

A Catalytic and Interfacing PEDOT:PSS/CuPc Polymerized on Cloth Fiber to Electro‐Metalize Stretchable Copper Conductive Pattern

Jing Li, Guoyun Zhou, Yan Hong, Chia‐Yun Chen, Wei He, Shouxu Wang, Yuanming Chen, Chong Wang, Yukai Sun, Chingping Wong

Advanced Materials Interfaces· Volume 9· Issue 16
Publisher page

Abstract

Abstract Copper conductive pattern should provide dependent flexibility on coated cloth‐fiber to support the signal transmission or current carrier for stretchable and reliable electronics. The design of copper phthalocyanine (CuPc) introduced in poly(3,4‐ethylenedioxythiophene) and polystyrene sulfonate acid (PEDOT:PSS) polymer network promotes the realization of copper electro‐metallization from its inner active dots, leading to a structure of PEDOT:PSS/CuPc‐rooted copper coating. The bridge‐layer of elastic PEDOT:PSS/CuPc interfacing and catalyzing the copper layer with excellent ductility and antioxidation, is developed to sustain the required stretchability for electronics on regular cloth polyurethane fiber. Experimental results demonstrate that this design achieves a perfect 80% conductivity of bulk copper, an ignored resistance changes after bending test, tensile test, 10 days’ natural oxidation, and 10 times’ machine‐washing, respectively. Accordingly, a breakthrough is made to supply the compatible integrity of copper line on cloth fiber for wearable electronics.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Conducting polymers and applications · Supercapacitor Materials and Fabrication

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Materials and Energy University of Electronic Science and Technology of China Chengdu 610054 P. R. China

Center for Applied Chemistry University of Electronic Science and Technology of China Chengdu 610054 P. R. China

Zhuhai Founder Sci‐Tech High‐density Electronics Co. Ltd. & Zhuhai Founder Sci‐Tech multilayer circuit board Co., Ltd. Zhuhai 519175 China

Department of Materials Science and Engineering National Cheng Kung University Tainan 70101 Taiwan

School of Material Science and Engineering Georgia Institute of Technology Atlanta GA 30332 USA

Funding

National Natural Science Foundation of China

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