Printed Electronics: Printing a Self‐Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity (Adv. Mater. Interfaces 3/2015)

A new ink containing a self-reducing copper precursor is printed on a donor substrate, and upon its decomposition the metal is transferred to an acceptor substrate. This new process, reactive transfer printing (RTP), is demonstrated in article 1400448 by S. Magdassi and co-workers, using copper formate as the precursor, forming a copper pattern with excellent conductivity (50% bulk copper). The illustration presents a printed blue donor pattern before decomposition and the obtained copper pattern after thermal decomposition.