Chemical Protection of Polycarbonate Surfaces by Atomic Layer Deposition of Alumina with Oxygen Plasma Pretreatment
Source abstract
Abstract
This study reports the effect of an O2 plasma pretreatment of polycarbonate (PC) films for the enhanced integration of Al2O3 films prepared by atomic layer deposition (ALD) on the PC substrate. It is revealed that the plasma treatment produces functional groups on the PC surface, which are essential for the ALD of Al2O3. Specifically, it is revealed that a significant amount of carbonyl groups, essential for the chemisorption of the precursors and covalent binding with the Al2O3 surface protection layer, are present in the plasma‐treated PC surface. To evaluate the chemical resistivity of the PC‐ALD alumina film, an acetone immersion test is conducted. As a result, a severe degradation occurs in the plasma‐untreated PCs, even with a sufficiently thick ALD alumina protection layer. In contrast, the PCs that are plasma‐treated and coated with the ALD alumina exhibit a significantly improved stability against acetone etching. Light transmittance and surface morphology analysis support this improvement.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Semiconductor materials and devices · Copper Interconnects and Reliability · Metal and Thin Film Mechanics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Mechanical Engineering Korea University 145 Anam‐ro Seongbuk‐gu Seoul 02841 Korea
High‐Temperature Energy Materials Research Center Korea Institute of Science and Technology (KIST) 14‐5 Hwarang‐ro Seongbuk‐gu Seoul 02792 Korea
School of Engineering University of California Merced 5200 North Lake Merced CA 95343 USA
Funding
Korea Small and Medium Business Administration · The Brain Korea 21 Plus
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