journal article·2025-09Open access

Reduced Passivity and Enhanced Pitting Around Crack Tip Measured Using Scanning Electrochemical Cell Microscopy

Sarah R. Yassine, Egor Katkov, Sarah Blunk, Pierre‐Antony Deschênes, Robert Lacasse, Janine Mauzeroll

Advanced Materials Interfaces· Volume 12· Issue 18

Abstract

Abstract Stainless steels, widely used in industrial applications, are often subjected to combined corrosive and mechanical stress conditions, leading to corrosion fatigue. Herein, it is investigated how stress‐induced deformation impacts the localized corrosion behavior of the CA6NM martensitic stainless steel using oil‐immersed scanning electrochemical cell microscopy (SECCM). Compact tension specimens are cyclically loaded to induce plasticity around a growing crack, and electrochemical properties are mapped with high spatial resolution. The electrochemical activity is progressively changed near the crack, with open circuit potential and corrosion potential shifting toward more active values as the distance to the crack decreases. Pitting is also more frequent closer to the crack, gradually declining further away, indicating a spatial dependence in localized corrosion behavior. These findings help understanding how mechanical stress modifies passivity and pitting susceptibility, contributing to a better understanding of corrosion‐fatigue mechanisms and materials design.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Corrosion Behavior and Inhibition · Hydrogen embrittlement and corrosion behaviors in metals · Force Microscopy Techniques and Applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Chemistry McGill University 845 Sherbrooke St W. Montreal Québec H3A 0G4 Canada

Department of Mining and Materials Engineering McGill University Montreal QC H3A 0C5 Canada

Hydro‐Québec Research Institute (IREQ) 1800 Bd Lionel‐Boulet, Varennes Québec J3X 1S1 Canada

Funding

Fonds de recherche du Québec – Nature et technologies

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