journal article·2018-12

Progress in Powder Coating Technology Using Atomic Layer Deposition

Sangeeta Adhikari, Seenivasan Selvaraj, Do‐Heyoung Kim

Advanced Materials Interfaces· Volume 5· Issue 24
Publisher page

Abstract

Adv. Mater. Interfaces. 2018, 5, 1800581 Section 3 of the article presents the processing conditions for ALD that affect the characteristics of the deposited films. It is mostly a summary of Section 5 of the Feature Article by H. Van Bui et al. [1]. This reference was initially omitted and now renders Section 3 of the above mentioned article redundant. Therefore, section 3 of the article will be replaced by the following text: “The processing conditions required for ALD vary considerably depending on the nature of the material to be deposited and also on the type of substrate. The effect of processing conditions in ALD technique has been well documented in the literature and debated by many research groups. [1, 2, 3]” The authors sincerely apologize for the error and any inconvenience caused to the readers. [1] H. Van Bui, F. Grillo, J. R. van Ommen, Chem. Commun. 2017, 53, 45. [2] S. M. George, Chem. Rev. 2010, 110, 111. [3] T. J. Knisley, L. C. Kalutarage, C. H. Winter, Coord. Chem. Rev. 2013, 257, 3222.
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Research context

OpenAlex topics: Adhesion, Friction, and Surface Interactions · Copper Interconnects and Reliability · Semiconductor materials and devices

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References

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