Progress in Powder Coating Technology Using Atomic Layer Deposition
Source abstract
Abstract
Adv. Mater. Interfaces. 2018, 5, 1800581 Section 3 of the article presents the processing conditions for ALD that affect the characteristics of the deposited films. It is mostly a summary of Section 5 of the Feature Article by H. Van Bui et al. [1]. This reference was initially omitted and now renders Section 3 of the above mentioned article redundant. Therefore, section 3 of the article will be replaced by the following text: “The processing conditions required for ALD vary considerably depending on the nature of the material to be deposited and also on the type of substrate. The effect of processing conditions in ALD technique has been well documented in the literature and debated by many research groups. [1, 2, 3]” The authors sincerely apologize for the error and any inconvenience caused to the readers. [1] H. Van Bui, F. Grillo, J. R. van Ommen, Chem. Commun. 2017, 53, 45. [2] S. M. George, Chem. Rev. 2010, 110, 111. [3] T. J. Knisley, L. C. Kalutarage, C. H. Winter, Coord. Chem. Rev. 2013, 257, 3222.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Adhesion, Friction, and Surface Interactions · Copper Interconnects and Reliability · Semiconductor materials and devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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