journal article·2024-01Open access

Morphology of Silver Particles and Films Arising from Particle‐Free Silver Ink Droplet Evaporation

Weipeng Zhang, Jun Yang, George K. Knopf

Advanced Materials Interfaces· Volume 11· Issue 1

Abstract

Abstract The evaporation of particle‐free silver ink droplets on heated substrates directly impacts the morphology of the resultant silver particles and electrically conductive inkjet‐printed films. In this work, COMSOL Multiphysics simulations of the droplet evaporation process are used to help explain the fluidic processes responsible for the experimental observations. The results show that the silver particle morphology depends on its location within the evaporating droplet where large particles (3 to 5 µm) accumulate at the center and smaller ones (1 to 2 µm) in the area beyond the central region. The smallest particles (≈500 nm) are near the contact line. Without the fluoro‐surfactant FS‐31, an inner ring with 3 µm particles also appears within the evaporating droplet. The large particles at the central region originate from the fluid near the droplet's apex due to the accumulation of polyacrylamide in the concentrated ethylene glycol solvent near the flow‐abundant apex. Furthermore, the capillary flow along the fluid–air interface transports silver ions and particles throughout the droplet, causing the larger particles to fall onto the substrate at the central vortex, forming the inner ring. The simulations also demonstrate that the evaporating droplet heterogeneously accumulates ethylene glycol in a sandhill formation at the bottom center.
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Research context

OpenAlex topics: Nanomaterials and Printing Technologies · Innovative Microfluidic and Catalytic Techniques Innovation · Gold and Silver Nanoparticles Synthesis and Applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Mechanical and Materials Engineering The University of Western Ontario London Ontario N6A 5B9 Canada

Shenzhen Institute for Advanced Study University of Electronic Science and Technology of China Shenzhen Guangdong 518110 China

Funding

Natural Sciences and Engineering Research Council of Canada

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