Influences of Native Oxide on the Properties of Ultrathin Al2O3‐Interfaced Si/GaAs Heterojunctions
Source abstract
Abstract
Abstract The structure property of non‐ideal Si/GaAs heterostructures that are integrated with the ultra‐thin oxide (UO) tunneling interfacial layer is systematically investigated. Si nanomembranes (NMs) are oxidized in different time periods prior to the hetero‐integration process to create the non‐ideal single‐side passivated Si/GaAs heterostructure. The atomic‐level oxygen distribution and the degree of oxygen content in Si NM and GaAs are carefully investigated using atom probe tomography (APT) and X‐ray photoelectron spectroscopy (XPS) to trace changes in the chemical composition and reactional mechanism across the UO interface when the surface of Si NM is exposed to air for different periods of time. The negatively induced charges at the UO layer cause oxygen diffusion to the GaAs layer and form the unwanted GaAs oxide layer. This native oxide stack noticeably degrades the thermal properties of the Si/GaAs heterostructure as Si NMs become more oxidized. This study reveals that the poor surface passivation on one side of the heterointerface leads to a both‐side oxidation, thus severely deteriorating the transport properties across the heterojunction formed with the UO layer.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Semiconductor materials and devices · Nanowire Synthesis and Applications · Advanced Materials Characterization Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Materials Design and Innovation University at Buffalo The State University of New York Buffalo NY 14260 USA
Microsystems Engineering Ph.D. Program NanoPower Research Laboratories Department of Electrical and Microelectronic Engineering Rochester Institute of Technology Rochester NY 14623 USA
References (32)
Show source-provided references
1. T.Kazior J.LaRoche D.Lubyshev J.Fastenau W.Liu M.Urteaga W.Ha J.Bergman M.Choe M.Bulsara presented at 2009 IEEE MTT‐S International Microwave Symposium Digest Boston MA USA2009.
2. K. H.Lee S.Bao D.Kohen C. C.Huang K. E. K.Lee E.Fitzgerald C. S.Tan presented at 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) San Diego California USA2015.
3. 10.1063/1.503804410.1063/1.5038044 ↗
4. 10.1038/srep0129110.1038/srep01291 ↗
5. 10.1038/nphoton.2012.16010.1038/nphoton.2012.160 ↗
6. 10.1146/annurev-matsci-070909-10444810.1146/annurev-matsci-070909-104448 ↗
7. 10.1201/978131537244010.1201/9781315372440 ↗
8. 10.1109/2944.99140710.1109/2944.991407 ↗
9. 10.1038/srep0034910.1038/srep00349 ↗
10. A.Tauzin E.Lagoutte T.Salvetat J.Guelfucci Y.Bogumilowicz B.Imbert F.Fournel S.Reboh F. P.Luce C.Lecouvey presented at AIP Conference Proceedings Vol.1679 AIP Publishing Aix‐les‐Bains France2015 p.040009.10.1063/1.4931520 ↗
11. 10.1016/S0169-4332(97)80187-010.1016/S0169-4332(97)80187-0 ↗
12. 10.1149/2.0041511ssl10.1149/2.0041511ssl ↗
13. 10.1109/JPHOTOV.2013.227309710.1109/JPHOTOV.2013.2273097 ↗
14. 10.7567/APEX.6.02180110.7567/APEX.6.021801 ↗
15. 10.7567/1882-0786/aaeedd10.7567/1882-0786/aaeedd ↗
16. D.Liu S. J.Cho J.‐H.Seo K.Kim M.Kim J.Shi X.Yin W.Choi C.Zhang J.Kim arXiv preprint arXiv:1812.102252018.
17. 10.1039/C7TC02221B10.1039/C7TC02221B ↗
18. 10.1080/21663831.2020.171823110.1080/21663831.2020.1718231 ↗
19. Z.Ma J.‐H.Seo US patent 8 866 1542014.
20. 10.1063/1.501118010.1063/1.5011180 ↗
21. 10.1063/5.002786410.1063/5.0027864 ↗
22. 10.35848/1347-4065/ac3d4510.35848/1347-4065/ac3d45 ↗
23. 10.1063/1.34718110.1063/1.347181 ↗
24. 10.1557/s43578-020-00072-710.1557/s43578-020-00072-7 ↗
25. 10.1134/S106378261914012410.1134/S1063782619140124 ↗
26. Sze S. M. · 2021
27. 10.1016/S0040-6090(01)01466-310.1016/S0040-6090(01)01466-3 ↗
28. 10.3390/electronicmat204003410.3390/electronicmat2040034 ↗
29. 10.1088/2632-959X/abc1c410.1088/2632-959X/abc1c4 ↗
30. 10.1149/2162-8777/ab981e10.1149/2162-8777/ab981e ↗
31. 10.1038/s41528-017-0001-110.1038/s41528-017-0001-1 ↗
32. 10.1016/j.ultramic.2006.06.00810.1016/j.ultramic.2006.06.008 ↗