Flexible Electronics: Ultrathin Silicon Circuits With Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (Adv. Mater. 36/2009)

The cover shows a silicon integrated circuit on a paper substrate. The system consists of ultrathin devices electrically and mechanically interconnected with stretchable, serpentine ribbons. A low modulus elastomeric adhesive isolates the circuit from strains associated with bending and folding the paper. This strategy provides a route to high quality electronics on paper, vinyl, leather and other unusual substrates, as reported by John Rogers and co-workers on p. 3703.