Nanoscale Dewetting: Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing (Adv. Mater. 21/2020)
Source abstract
Abstract
In article number 1908422, Tae-il Kim and co-workers introduce a facile electrical interconnection method driven by selective dewetting of polymer adhesive, which is applicable to a deterministic microelectronics assembly for flexible electronics. Controlled dewetting of the coated polymeric adhesive is triggered on specific electrode regions, forming vertical interconnection of the microelectronics. Especially, thousands of 30 μm × 60 μm-scale micro LEDs are demonstrated.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Nanomaterials and Printing Technologies · Nanofabrication and Lithography Techniques
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Affiliations
School of Chemical Engineering Sungkyunkwan University (SKKU) Suwon 16419 Republic of Korea
Global Technology Center Samsung Electronics Co., Ltd. 129, Samsung‐ro, Yeongtong‐gu Suwon‐si Gyeonggi‐do 16677 Republic of Korea
School of Chemical Engineering Department of Biomedical Engineering and Biomedical Institute for Convergence at SKKU (BICS) Sungkyunkwan University (SKKU) Suwon 16419 Republic of Korea
References
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