In Situ Device‐Level TEM Characterization Based on Ultra‐Flexible Multilayer MoS2 Micro‐Cantilever (Adv. Mater. 28/2023)
Source abstract
Abstract
TEM Cantilever Chips In article number 2301439, Chaojian Hou, Jing Zhao, Lixin Dong, and co-workers report a cantilever chip for in situ transmission electron microscopy (TEM). The chip consists of a MoS2 opto-electromechanical sensor and a plasmonic antenna array built on the top of a Si3N4 cantilever, forming an electron-beam-transparent (thickness ≈100 nm) nano-opto-electromechanical system (NOEMS), enabling the in situ calibration/characterization of the NOEMS sensor or another device, with the NOEMS serving as a sensor to correlate the physical properties and atomic structures.
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Research context
OpenAlex topics: Gas Sensing Nanomaterials and Sensors
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Affiliations
Department of Biomedical Engineering City University of Hong Kong Hong Kong 999077 P. R. China
Shenzhen Key Laboratory of Marine Archaea Geo‐Omics Department of Ocean Science and Engineering Southern University of Science and Technology (SUSTech) Shenzhen Guangdong 518055 P. R. China
Southern Marine Science and Engineering Guangdong Laboratory (Guangzhou) Guangzhou Guangdong 511458 P. R. China
School of Mechatronical Engineering Beijing Institute of Technology Beijing 100081 P. R. China
References
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