Rapid Drying Principle for High‐speed, Pinhole‐Less, Uniform Wet Deposition Protocols of Water‐Dispersed 2D Materials

Abstract Inexpensive, high‐speed deposition techniques that ensure uniformity, scalability, wide applicability, and tunable thickness are crucial for the practical application of 2D materials. In this work, rapid drying is identified as a key mechanism for pioneering two high‐speed wet deposition methods: hot dipping and air knife sweeping (AKS). Both techniques allow thickness control proportional to flake concentration, achieving tiled monolayers and pinhole‐free coverage across the entire substrate, as long as evaporation outpaces flake diffusion. AKS prevents non‐uniformity along substrate edges by eliminating contact line pinning. The achieved deposition speed of 0.21 m ² min ⁻¹ with AKS significantly surpasses traditional methods, enabling the equipment for large substrates > 1 m ² . Combined with the ultralow debonding force for mechanically susceptible flexible display production and short‐circuit‐proof nanometer‐thin capacitors with capacitance comparable to commercial multilayer ceramic capacitors (MLCCs), these new protocols showcase simple and swift solutions for manufacturing 2D materials‐based nanodevices.