DataVXAdvanced MaterialsPaper
journal article·2013-12

Epidermal Electronics: Materials and Optimized Designs for Human‐Machine Interfaces Via Epidermal Electronics (Adv. Mater. 47/2013)

Jae‐Woong Jeong, Woon‐Hong Yeo, Aadeel Akhtar, James J. S. Norton, Young‐Jin Kwack, Shuo Li, Sung‐Young Jung, Yewang Su, Woosik Lee, Jing Xia, Huanyu Cheng, Yonggang Huang, Woon‐Seop Choi, Timothy Bretl, John A. Rogers

Advanced Materials· Volume 25· Issue 47
Publisher page
Source abstract

Abstract

Thin, soft, and elastic electronics, which have physical properties well matched to the epidermis, can be conformally and robustly integrated with the skin. Materials and optimized design of such devices are presented for surface electromyography (sEMG) by J. A. Rogers and co-workers on page 6839. The skin-integrated electronics shown here enable use of sEMG for advanced forms of human-machine interfaces.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials

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Affiliations

Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana‐Champaign Urbana Illinois 61801 USA

Medical Scholars Program, Neuroscience Program University of Illinois at Urbana‐Champaign Urbana Illinois 61801 USA

Neuroscience Program University of Illinois at Urbana‐Champaign Urbana Illinois 61801 USA

School of Display Engineering Hoseo University Asan 336‐795 Republic of Korea

Department of Mechanical engineering Pohang University of Science and Technology Pohang 790‐784 Republic of Korea

Center for Mechanics and Materials Tsinghua University Beijing 100084, China Department of Civil and Environmental Engineering Department of Mechanical Engineering Center for Engineering and Health Northwestern University Evanston Illinois 60208 USA

Department of Engineering Mechanics Tsinghua University Beijing 100084, China Department of Civil and Environmental Engineering Department of Mechanical Engineering Center for Engineering and Health Northwestern University, Evanston Illinois 60208 USA

Department of Civil and Environmental Engineering Department of Mechanical Engineering Center for Engineering and Health Northwestern University Evanston Illinois 60208 USA

Department of Aerospace Engineering University of Illinois at Urbana‐Champaign Urbana Illinois 61801 USA

Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana‐Champaign Urbana Illinois 61801 USA

References

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