Integrated Carbon Nanotube Array as Dry Adhesive for High‐Temperature Silicon Processing

CNT arrays are used as removable dry adhesives for high-temperature processes with temperatures that increase by as much as 900 °C. The adhesion force between the self-assembled CNTs is utilized to strain the microstructures in high-temperature environments. Arrays of analog micromirrors are successfully fabricated by silicon processing. The proposed method significantly simplifies the fabrication process. Detailed facts of importance to specialist readers are published as ”Supporting Information”. Such documents are peer-reviewed, but not copy-edited or typeset. They are made available as submitted by the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.