Three‐Dimensional Assembly of Polymer Microstructures at Low Temperatures
Source abstract
Abstract
A low‐temperature, low‐pressure polymer bonding technique for three‐dimensional assembly of microstructures (see Figure; scale bar 5 μm) based on carbon dioxide (CO2)‐enhanced chain entanglement near the polymer surfaces is presented. The environmentally benign utilization of supercritical CO2 offers scope for the production of polymer‐based biomedical applications and devices.
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Research context
OpenAlex topics: Polymer Foaming and Composites · Phase Equilibria and Thermodynamics · Injection Molding Process and Properties
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References (30)
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