Regular Arrays of Copper Wires Formed by Template‐Assisted Electrodeposition
Source abstract
Abstract
An easy, cheap, high‐throughput way to generate metallic wire arrays by patterned electrodeposition is reported. Copper is electrodeposited on the surface of a regularly striped Langmuir–Blodgett film, forming an array of submicrometer‐wide wires with homogeneous width (see Figure). Width and separation of the wires can be tuned by the template.
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Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Block Copolymer Self-Assembly · Copper Interconnects and Reliability
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