Effect of bond-line thickness and mode-mixity on the fracture behavior and traction separation law of Sn-0.7Cu solder joints
Source abstract
Abstract
Abstract In this research, cohesive parameters were extracted for Sn-0.7Cu/Cu solder joint failure. Double cantilever beam (DCB) specimens were used to study the fracture of the joint under both mode-I and mixed-mode conditions. A bilinear traction separation law (TSL) was used to capture the failure of the joint. Increasing the bond-line thickness from 110 to 880 µm increased the critical energy release rate for crack initiation (Gci) and maximum traction of the bilinear TSL. This increase in the Gci was attributed to an increase in plastic zone area (PZA) ahead of the pre-crack tip. Varying the mode-mixity with phase angle (ψ) in the range of 00–330 showed an insignificant change in Gci and maximum traction of the bilinear TSL.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Advanced Welding Techniques Analysis · Fatigue and fracture mechanics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (51)
Show source-provided references
1. Toxicity, mechanism and health effects of some heavy metals10.2478/intox-2014-0009 ↗
2. Toxicity of lead : A review with recent updates10.2478/v10102-012-0009-2 ↗
3. A review of lead-free solders for electronics applications10.1016/j.microrel.2017.06.016 ↗
4. Lead-Free Solders in IC Manufacture : A Review10.1023/A:1024579616706 ↗
5. Lead-free solders in microelectronics10.1016/S0927-796X(00)00010-3 ↗
6. A review of mechanical properties of lead-free solders for electronic packaging10.1007/s10853-008-3125-9 ↗
7. A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products10.1016/j.microrel.2011.07.093 ↗
8. Effect of geometry on the fracture behavior of lead-free solder joints10.1016/j.engfracmech.2011.01.026 ↗
9. Combined effect of strain-rate and mode-ratio on the fracture of lead-free solder joints10.1016/j.matdes.2015.06.134 ↗
10. S.P.V. Nadimpalli, J.K. Spelt, Mixed-mode fracture load prediction in lead-free solder joints Eng. Fract. Mech. 78 (2011).10.1016/j.engfracmech.2010.09.011 ↗
11. R-curve behavior of Cu-Sn3.0Ag0.5Cu solder joints: Effect of mode ratio and microstructure10.1016/j.msea.2009.08.046 ↗
12. Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate10.1023/B:JMSC.0000033401.38785.73 ↗
13. Fracture load prediction of lead-free solder joints10.1016/j.engfracmech.2010.09.012 ↗
14. High-speed bend test method and failure prediction for drop impact reliability
15. Drop impact reliability testing for lead-free and lead-based soldered IC packages10.1016/j.microrel.2005.10.011 ↗
16. Experimental and finite element analysis of the shear speed effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints10.1016/j.msea.2003.12.012 ↗
17. BGA brittle fracture - Alternative solder joint integrity test methods Proc. - Electron
18. Predicting environmental degradation of adhesive joints using a cohesive zone finite element model based on accelerated fracture tests10.1016/j.ijadhadh.2017.02.007 ↗
19. The effects of test temperature and humidity on the mixed-mode fatigue behavior of a toughened adhesive aluminum joint10.1016/j.engfracmech.2011.01.028 ↗
20. Effect of adhesive thickness on fatigue and fracture of toughened epoxy joints – Part I : Experiments10.1016/j.engfracmech.2010.06.025 ↗
21. Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn–3Cu joints10.1016/j.scriptamat.2012.07.024 ↗
22. Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu-Cu solder joints during shear testing10.1016/j.msea.2011.09.063 ↗
23. Fracture of a ductile layer constrained by stiff substrates10.1046/j.1460-2695.2001.00371.x ↗
24. Effects of mode mix upon fracture behavior of a solder joint10.1023/A:1014264930542 ↗
25. Mixed mode fracture toughness of lead-tin and tin-silver solder joints with nickel-plated substrate10.1016/j.msea.2005.05.086 ↗
26. Influence of interfacial intermetallic compound on fracture behavior of solder joints10.1016/S0921-5093(03)00277-6 ↗
27. Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints10.1007/s11664-001-0119-7 ↗
28. Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints10.1109/96.575568 ↗
29. An analysis of the conditions for rupture due to griffith cracks10.1088/0959-5309/59/2/305 ↗
30. The Mathematical Theory of Equilibrium Cracks in Brittle Fracture10.1016/S0065-2156(08)70121-2 ↗
31. Yielding of steel sheets containing slits10.1016/0022-5096(60)90013-2 ↗
32. A comparison of the fracture criteria of Griffith and Barenblatt10.1016/0022-5096(67)90029-4 ↗
33. A path independent integral and the approximate analysis of strain concentration by notches and cracks10.1115/1.3601206 ↗
34. The phenomena of rupture and flow in solids10.1098/rsta.1921.0006 ↗
35. Cohesive zone modeling of crack nucleation at bimaterial corners10.1016/S0022-5096(99)00052-6 ↗
36. Cohesive modeling of solder interconnect failure in board level drop test Thermomechanical Phenom
37. Fracture load prediction of BGA solder joints: Cohesive zone modeling and experimental verification10.1016/j.ijsolstr.2016.04.013 ↗
38. A continuum model for void nucleation by inclusion debonding10.1115/1.3173064 ↗
39. Measuring the mode-I adhesive fracture energy, GIC, of structural adhesive joints: The results of an international round-robin10.1016/S0143-7496(03)00047-2 ↗
40. Mixed mode energy release rates for adhesively bonded beam specimens10.1520/CTR10412J ↗
41. Mixed mode fracture characterization of adhesive joints10.1016/0266-3538(94)90052-3 ↗
42. Adherend thickness influence on fatigue behavior and fatigue failure prediction of adhesively bonded joints
43. Abaqus User’s Manual 6.13, Dassault Systèmes Simulia Corp.; Providence; RI; USA 1 58.
44. Mixed Mode Cracking in Layered Materials10.1016/S0065-2156(08)70164-9 ↗
45. Structural and elastic properties of eutectic Sn – Cu lead-free solder alloy containing small amount of Ag and In10.1016/j.jallcom.2011.01.062 ↗
46. Effect of processing parameters on fracture toughness of lead-free solder joints10.1016/j.engfracmech.2015.05.042 ↗
47. Azari · Effect of substrate modulus on the fatigue behavior of adhesively bonded joints · 2012 · 534 · 594
48. Fracture Toughness of Adhesive Joints10.1080/00218467108081159 ↗
49. Temperature, moisture and mode-mixity effects on copper leadframe / EMC interfacial fracture toughness10.1007/s10704-013-9907-3 ↗
50. Composites : Part B Effects of bondline thickness on mode-I nonlinear interfacial fracture of laminated composites : An experimental study10.1016/j.compositesb.2012.10.048 ↗
51. Application a direct / cohesive zone method for the evaluation of scarf adhesive joints Appl