Cause analysis on the unqualified pull-out force between the bushing and PCB pad in DC-DC converters for new energy vehicles
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OpenAlex topics: Advanced Battery Technologies Research · Electronic Packaging and Soldering Technologies · Additive Manufacturing and 3D Printing Technologies
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References (21)
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1. Performance optimization of mild hybrid passenger vehicle by dual control strategy for city driving cycle10.1016/j.energy.2020.118953 ↗
2. A comprehensive overview of the dc-dc converter-based battery charge balancing methods in electric vehicles10.1016/j.rser.2020.110274 ↗
3. A review of DC/DC converter-based electrochemical impedance spectroscopy for fuel cell electric vehicles10.1016/j.renene.2019.03.130 ↗
4. Reliability study of motor controller in electric vehicle by the approach of fault tree analysis10.1016/j.engfailanal.2020.105165 ↗
5. A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow10.1016/j.microrel.2020.113791 ↗
6. Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering10.1016/j.microrel.2017.10.011 ↗
7. Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball10.1016/j.apsusc.2018.05.129 ↗
8. Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying
9. Shear strength and fracture analysis of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu pastes with Cu-substrate joints under different reflow times10.1016/j.microrel.2021.114378 ↗
10. Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3.0Ag0.5Cu solder interconnects10.1016/j.engfracmech.2018.09.031 ↗
11. Bushing failure in power transformers and the influence of moisture with the spectroscopy test10.1016/j.engfailanal.2018.08.006 ↗
12. Interference and thickness design of bushing of connecting rod small end for Anti-loosening10.1016/j.engfailanal.2021.105556 ↗
13. Research on the hydroformed metal stator bushing based on full restraint at both ends10.1016/j.engfailanal.2021.105591 ↗
14. Failures on DC–DC modules following a change of wire bonding material from gold to copper10.1016/j.microrel.2015.07.032 ↗
15. Power switch failures tolerance and remedial strategies of a 4-leg floating interleaved DC/DC boost converter for photovoltaic/fuel cell applications10.1016/j.renene.2015.12.054 ↗
16. A prognostic method for predicting failure of dc/dc converter10.1016/j.microrel.2017.05.014 ↗
17. Stability and reliability of LTCC-based 5/12 V dual output DC-DC converter with high efficiency and small size10.1016/j.mejo.2020.104937 ↗
18. Optimization for warpage and residual stress due to reflow process in IGBT modules based on pre-warped substrate10.1016/j.mee.2015.04.019 ↗
19. Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
20. Flux effect on void quantity and size in soldered joints10.1016/j.microrel.2016.03.009 ↗
21. Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process