DataVXAdvanced MaterialsPaper
journal article·2024-06

Mitigating the Overheat of Stretchable Electronic Devices Via High‐Enthalpy Thermal Dissipation of Hydrogel Encapsulation

Can Cao, Shaobo Ji, Ying Jiang, Jiangtao Su, Huarong Xia, Haicheng Li, Changhao Tian, Yi Jing Wong, Xue Feng, Xiaodong Chen

Advanced Materials· Volume 36· Issue 26
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Source abstract

Abstract

Abstract The practical application of flexible and stretchable electronics is significantly influenced by their thermal and chemical stability. Elastomer substrates and encapsulation, due to their soft polymer chains and high surface‐area‐to‐volume ratio, are particularly susceptible to high temperatures and flame. Excessive heat poses a severe threat of damage and decomposition to these elastomers. By leveraging water as a high enthalpy dissipating agent, here, a hydrogel encapsulation strategy is proposed to enhance the flame retardancy and thermal stability of stretchable electronics. The hydrogel‐based encapsulation provides thermal protection against flames for more than 10 s through the evaporation of water. Further, the stretchability and functions automatically recover by absorbing air moisture. The incorporation of hydrogel encapsulation enables stretchable electronics to maintain their functions and perform complex tasks, such as fire saving in soft robotics and integrated electronics sensing. With high enthalpy heat dissipation, encapsulated soft electronic devices are effectively shielded and retain their full functionality. This strategy offers a universal method for flame retardant encapsulation of stretchable electronic devices.
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Research context

Polymers

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Green IT and Sustainability

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Institute of Flexible Electronics Technology of THU Jiaxing Zhejiang 314000 China

Innovative Center for Flexible Devices (iFLEX) Max Planck‐NTU Joint Laboratory for Artificial Senses School of Materials Science and Engineering Nanyang Technological University Singapore 639798 Singapore

Institute of Functional Nano & Soft Materials (FUNSOM) Jiangsu Key Laboratory for Carbon‐Based Functional Materials & Devices Soochow University Suzhou 215123 China

Laboratory of Flexible Electronics Technology Tsinghua University Beijing 100084 China

AML Department of Engineering Mechanics Tsinghua University Beijing 100084 China

Institute of Materials Research and Engineering (IMRE) Agency for Science, Technology and Research (A*STAR) 2 Fusionopolis Way, #08‐03 Innovis Singapore 138634 Singapore

Institute for Digital Molecular Analytics and Science (IDMxS) Nanyang Technological University Singapore 639798 Singapore

Funding

National Research Foundation Singapore · Collaborative Innovation Center of Suzhou Nano Science and Technology

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