journal article·2022-03

Mechanically Guided Hierarchical Assembly of 3D Mesostructures

Hangbo Zhao, Xu Cheng, Changsheng Wu, Tzu‐Li Liu, Qinai Zhao, Shuo Li, Xinchen Ni, Shenglian Yao, Mengdi Han, Yonggang Huang, Yihui Zhang, John A. Rogers

Advanced Materials· Volume 34· Issue 12
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Abstract

Abstract 3D, hierarchical micro/nanostructures formed with advanced functional materials are of growing interest due to their broad potential utility in electronics, robotics, battery technology, and biomedical engineering. Among various strategies in 3D micro/nanofabrication, a set of methods based on compressive buckling offers wide‐ranging material compatibility, fabrication scalability, and precise process control. Previously reports on this type of approach rely on a single, planar prestretched elastomeric platform to transform thin‐film precursors with 2D layouts into 3D architectures. The simple planar configuration of bonding sites between these precursors and their assembly substrates prevents the realization of certain types of complex 3D geometries. In this paper, a set of hierarchical assembly concepts is reported that leverage multiple layers of prestretched elastomeric substrates to induce not only compressive buckling of 2D precursors bonded to them but also of themselves, thereby creating 3D mesostructures mounted at multiple levels of 3D frameworks with complex, elaborate configurations. Control over strains used in these processes provides reversible access to multiple different 3D layouts in a given structure. Examples to demonstrate these ideas through both experimental and computational results span vertically aligned helices to closed 3D cages, selected for their relevance to 3D conformal bio‐interfaces and multifunctional microsystems.
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Research context

OpenAlex topics: Advanced Materials and Mechanics · Modular Robots and Swarm Intelligence · Micro and Nano Robotics

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Querrey Simpson Institute for Bioelectronics Northwestern University Evanston IL 60208 USA

Department of Aerospace and Mechanical Engineering University of Southern California Los Angeles CA 90089 USA

Applied Mechanics Laboratory Department of Engineering Mechanics Center for Flexible Electronics Technology Tsinghua University Beijing 100084 China

Department of Mechanical Engineering Northwestern University Evanston IL 60208 USA

Beijing Advanced Innovation Center for Materials Genome Engineering School of Materials Science and Engineering University of Science and Technology Beijing Beijing 100083 China

Department of Biomedical Engineering College of Future Technology Peking University Beijing 100871 China

Department of Materials Science and Engineering Northwestern University Evanston IL 60208 USA

Department of Civil and Environmental Engineering Northwestern University Evanston IL 60208 USA

Department of Biomedical Engineering Northwestern University Evanston IL 60208 USA

Funding

National Natural Science Foundation of China · Materials Research Science and Engineering Center, Harvard University · Northwestern University · National Science Foundation

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