Photoresist Development for 3D Printing of Conductive Microstructures via Two‐Photon Polymerization

Abstract The advancement of electronic devices necessitates the development of three‐dimensional (3D) high‐precision conductive microstructures, which have extensive applications in bio‐electronic interfaces, soft robots, and electronic skins. Two‐photon polymerization (TPP) based 3D printing is a critical technique that offers unparalleled fabrication resolution in 3D space for intricate conductive structures. While substantial progress has been made in this field, this review summarizes recent advances in the 3D printing of conductive microstructures via TPP, mainly focusing on the essential criteria of photoresist resins suitable for TPP. Further preparation strategies of these photoresists and methods for constructing 3D conductive microstructures via TPP are discussed. The application prospects of 3D conductive microstructures in various fields are discussed, highlighting the imperative to advance their additive manufacturing technology. Finally, strategic recommendations are offered to enhance the construction of 3D conductive microstructures using TPP, addressing prevailing challenges and fostering significant advancements in manufacturing technology.